Liquid–Liquid Interfacial Tension in Ternary Monotectic Alloys Al–Bi–Cu and Al–Bi–Si

The liquid–liquid interfacial tension in the ternary monotectic alloys Al_34.5-x Bi_65.5Cu _x and (Al_0.345Bi_0.655)_100-x Si _x (mass%) has been determined as a function of its Cu (Si) content by a tensiometric technique. It is established that the interfacial tension gradually increases when either Cu or Si is added to Al–Bi alloys. The increase of $\sigma_{\alpha \beta}$ can be related to the increase of the miscibility gap (both width and height) when Cu (Si) is added to the Al–Bi binary. The temperature dependences of the interfacial tension in binary Al_34.5Bi_65.5 and ternary Al_23.25Bi_65.5Cu_11.25 and (Al_0.345Bi_0.655)₉₅Si₅ monotectic alloys are well described by the power function $\sigma_{\alpha \beta}=\sigma_{0}\cdot(1-T/T_{\rm C})^{\mu}$ with the critical-point exponent $\mu=1.3$.