Skip to main content
SpringerLink
Log in

Toward Mobile Integrated Electronic Systems at THz Frequencies

  • Published:
Journal of Infrared, Millimeter, and Terahertz Waves Aims and scope Submit manuscript

A Publisher Correction to this article was published on 22 September 2022

This article has been updated

Abstract

This paper discusses advances related to the integration of future mobile electronic THz systems. Without claiming to provide a comprehensive review of this surging research area, the authors gathered research on selected topics that are expected to be of relevance for the future exploration of components for practical mobile THz imaging and sensing applications. First, a brief technology review of integrated mobile THz components is given. Advances in III-V technology, silicon technology, and resonant-tunneling diodes (RTD) are discussed. Based on an RTD source and a SiGe-HBT direct detector, low-cost and compact computed tomography is presented for volumetric continuous-wave imaging at around 300 GHz. Moreover, aspects of system integration of mobile THz MIMO radars are discussed. Thereby, a novel phase-locked loop concept utilizing a high-stability yttrium-iron-garnet-tuned oscillator to synthesize ultra-stable reference mmWave signals is shown, and an adaptive self-interference cancellation algorithm for THz MIMO in the digital domain based on Kalman filter theory is proposed.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10

Similar content being viewed by others

Change history

References

  1. G.P. Kniffin, L.M. Zurk, IEEE Transactions on Terahertz Science and Technology 2(2), 231 (2012). https://doi.org/10.1109/TTHZ.2011.2181921.

  2. P. Rodríguez-Vázquez, J. Grzyb, B. Heinemann, U.R. Pfeiffer, IEEE Microwave and Wireless Components Letters 29(4), 297 (2019). https://doi.org/10.1109/LMWC.2019.2899487.

  3. K.K. Tokgoz, S. Maki, J. Pang, N. Nagashima, I. Abdo, S. Kawai, T. Fujimura, Y. Kawano, T. Suzuki, T. Iwai, K. Okada, A. Matsuzawa, in 2018 IEEE International Solid - State Circuits Conference - (ISSCC) (IEEE, 2018), pp. 168–170. https://doi.org/10.1109/ISSCC.2018.8310237. http://ieeexplore.ieee.org/document/8310237/.

  4. T. Jaeschke, C. Bredendiek, N. Pohl, pp. 1–4 (2013).

  5. J. Grzyb, K. Statnikov, N. Sarmah, B. Heinemann, U.R. Pfeiffer, IEEE Transactions on Terahertz Science and Technology 6(6), 771 (2016).

  6. C.M. Armstrong, IEEE Spectrum 49(9), 36 (2012). https://doi.org/10.1109/MSPEC.2012.6281131.

  7. F. Sheikh, Q.H. Abbasi, T. Kaiser, in 2019 13th European Conference on Antennas and Propagation (EuCAP) (2019), pp. 1–5.

  8. R. Piesiewicz, C. Jansen, D. Mittleman, T. Kleine-Ostmann, M. Koch, T. Kurner, IEEE Transactions on Antennas and Propagation 55(11), 3002 (2007). https://doi.org/10.1109/TAP.2007.908559.

  9. N. Palka, M. Szala, E. Czerwinska, Appl. Opt. 55(17), 4575 (2016). https://doi.org/10.1364/AO.55.004575. http://ao.osa.org/abstract.cfm?URI=ao-55-17-4575.

  10. Q. Cassar, A. Al-Ibadi, L. Mavarani, P. Hillger, J. Grzyb, G. MacGrogan, T. Zimmer, U.R. Pfeiffer, J.P. Guillet, P. Mounaix, Biomedical Optics Express 9(7), 2930 (2018).

  11. T. Bowman, M. El-Shenawee, L.K. Campbell, Biomed. Opt. Express 7(9), 3756 (2016). https://doi.org/10.1364/BOE.7.003756. http://www.osapublishing.org/boe/abstract.cfm?URI=boe-7-9-3756.

  12. C. Kulesa, 1(1), 232 (2011). https://doi.org/10.1109/TTHZ.2011.2159648.

  13. P. Hillger, J. Grzyb, R. Jain, U.R. Pfeiffer, IEEE Transactions on Terahertz Science and Technology 9(1), 1 (2019). https://doi.org/10.1109/TTHZ.2018.2884852.

  14. R. Han, Z. Hu, C. Wang, J. Holloway, X. Yi, M. Kim, J. Mawdsley, IEEE Microwave Magazine 20(4), 80 (2019). https://doi.org/10.1109/MMM.2019.2891379.

  15. X. Wu, H. Lu, K. Sengupta, Nature communications 10(1), 2722 (2019).

  16. Y. Tousi, E. Afshari, 50(2), 597 (2015). https://doi.org/10.1109/JSSC.2014.2375324.

  17. K. Sengupta, A. Hajimiri, IEEE Journal of Solid-State Circuits 47(12), 3013 (2012). https://doi.org/10.1109/JSSC.2012.2217831.

  18. U.R. Pfeiffer, Y. Zhao, J. Grzyb, R. Al Hadi, N. Sarmah, W. Förster, H. Rücker, B. Heinemann, 49(12), 2938 (2014). https://doi.org/10.1109/JSSC.2014.2358570.

  19. P. Hillger, R. Jain, J. Grzyb, W. Förster, B. Heinemann, G. MacGrogan, P. Mounaix, T. Zimmer, U.R. Pfeiffer, 53(12), 3599 (2018). https://doi.org/10.1109/JSSC.2018.2878817.

  20. K. Kasagi, S. Suzuki, M. Asada, Journal of Applied Physics 125(15), 151601 (2019). https://doi.org/10.1063/1.5051007. https://doi.org/10.1063/1.5051007.

  21. R. Han, E. Afshari, 48(12), 3090 (2013). https://doi.org/10.1109/JSSC.2013.2272864. http://ieeexplore.ieee.org/document/6570736/.

  22. S. Jameson, E. Socher, 24(7), 463 (2014). https://doi.org/10.1109/LMWC.2014.2316210.

  23. K. Guo, A. Standaert, P. Reynaert, 8(3), 340 (2018). https://doi.org/10.1109/TTHZ.2018.2815783. https://ieeexplore.ieee.org/document/8331124/.

  24. B. Khamaisi, S. Jameson, E. Socher, in 11th European Microwave Integrated Circuits Conf. (London, UK, 2016), pp. 389–392. https://doi.org/10.1109/EuMIC.2016.7777573. http://ieeexplore.ieee.org/document/7777573/.

  25. S.P. Voinigescu, A. Tomkins, E. Dacquay, P. Chevalier, J. Hasch, A. Chantre, B. Sautreuil, 48(9), 2011 (2013). https://doi.org/10.1109/JSSC.2013.2265494.

  26. F. Ahmed, M. Furqan, B. Heinemann, A. Stelzer, IEEE Transactions on Microwave Theory and Techniques 66(3), 1384 (2018). https://doi.org/10.1109/TMTT.2017.2767593.

  27. R. Han, C. Jiang, A. Mostajeran, M. Emadi, H. Aghasi, H. Sherry, A. Cathelin, E. Afshari, 50(12), 2935 (2015). https://doi.org/10.1109/JSSC.2015.2471847.

  28. H. Jalili, O. Momeni, in IEEE Radio Frequency Integrated Circuits Symp. (San Francisco, CA, USA, 2016), pp. 182–185. https://doi.org/10.1109/RFIC.2016.7508281. http://ieeexplore.ieee.org/document/7508281/.

  29. P. Hillger, J. Grzyb, S. Malz, B. Heinemann, U. Pfeiffer, in IEEE Radio Frequency Integrated Circuits Symp. (Honolulu, HI, USA, 2017), pp. 160–163. https://doi.org/10.1109/rfic.2017.7969042.

  30. P. Hillger, J. Grzyb, R. Lachner, U. Pfeiffer, in 10th European Microwave Integrated Circuits Conf. (Paris, France, 2015), pp. 180–183. https://doi.org/10.1109/eumic.2015.7345098.

  31. Z. Hu, M. Kaynak, R. Han, 53(5), 1313 (2018). https://doi.org/10.1109/JSSC.2017.2786682. https://ieeexplore.ieee.org/document/8254345/.

  32. S. Suzuki, M. Shiraishi, H. Shibayama, M. Asada, IEEE Journal of Selected Topics in Quantum Electronics 19(1), 8500108 (2012).

  33. M. Kim, J. Lee, J. Lee, K. Yang, IEEE Transactions on Terahertz Science and Technology 6(3), 510 (2016).

  34. J. Lee, M. Kim, K. Yang, IEEE Transactions on Terahertz Science and Technology 6(2), 336 (2016).

  35. A. Al-Khalidi, K.H. Alharbi, J. Wang, R. Morariu, L. Wang, A. Khalid, J.M.L. Figueiredo, E. Wasige, IEEE Transactions on Terahertz Science and Technology 10(2), 150 (2020).

  36. D. Kim, S. Jeon, IEEE Transactions on Microwave Theory and Techniques 67(7), 2759 (2019).

  37. J. Yun, D. Yoon, H. Kim, J. Rieh, IEEE Transactions on Microwave Theory and Techniques 62(12), 3053 (2014).

  38. D. Yoon, J. Yun, J. Rieh, IEEE Transactions on Terahertz Science and Technology 5(4), 652 (2015).

  39. J. Yun, J. Kim, D. Yoon, J.. Rieh, Electronics Letters 53(22), 1475 (2017).

  40. M. Hossain, N. Weimann, M. Brahem, O. Ostinelli, C.R. Bolognesi, W. Heinrich, V. Krozer, in 2019 49th European Microwave Conference(EuMC) (2019), pp. 856–859.

  41. K. Sengupta, T. Nagatsuma, D.M. Mittleman, Nature Electronics 1(12), 622 (2018).

  42. B. Heinemann, H. Rücker, R. Barth, F. Bärwolf, J. Drews, G.G. Fischer, A. Fox, O. Fursenko, T. Grabolla, F. Herzel, J. Katzer, J. Korn, A. Krüger, P. Kulse, T. Lenke, M. Lisker, S. Marschmeyer, A. Scheit, D. Schmidt, J. Schmidt, M.A. Schubert, A. Trusch, C. Wipf, D. Wolansky, in 2016 IEEE International Electron Devices Meeting (IEDM) (2016), pp. 3.1.1–3.1.4. https://doi.org/10.1109/IEDM.2016.7838335.

  43. Europractive. The europractice ics service. http://www.europractice.com.

  44. X. Mei, W. Yoshida, M. Lange, J. Lee, J. Zhou, P.H. Liu, K. Leong, A. Zamora, J. Padilla, S. Sarkozy, R. Lai, W. Deal, IEEE Electron Device Letters 36(4), 327 (2015). https://doi.org/10.1109/LED.2015.2407193.

  45. M. Urteaga, Z. Griffith, M. Seo, J. Hacker, M.J.W. Rodwell, Proceedings of the IEEE 105(6), 1051 (2017). https://doi.org/10.1109/JPROC.2017.2692178.

  46. C.R. Bolognesi, R. Flückiger, M. Alexandrova, W. Quan, R. Lövblom, O. Ostinelli, in 2016 IEEE International Electron Devices Meeting (IEDM) (2016), pp. 29.5.1–29.5.4. https://doi.org/10.1109/IEDM.2016.7838506.

  47. K. Shinohara, D.C. Regan, Y. Tang, A.L. Corrion, D.F. Brown, J.C. Wong, J.F. Robinson, H.H. Fung, A. Schmitz, T.C. Oh, S.J. Kim, P.S. Chen, R.G. Nagele, A.D. Margomenos, M. Micovic, IEEE Transactions on Electron Devices 60(10), 2982 (2013). https://doi.org/10.1109/TED.2013.2268160.

  48. M.J. Rodwell, M. Le, B. Brar, Proceedings of the IEEE 96(2), 271 (2008). https://doi.org/10.1109/JPROC.2007.911058.

  49. V. Radisic, W. Deal, K. Leong, X. Mei, W. Yoshida, P.H. Liu, J. Uyeda, A. Fung, L. Samoska, T. Gaier, R. Lai, IEEE Transactions on Microwave Theory and Techniques 58(7), 1903 (2010). https://doi.org/10.1109/TMTT.2010.2050105.

  50. D.S. Green, C.L. Dohrman, J. Demmin, Y. Zheng, T. Chang, IEEE Microwave Magazine 18(2), 44 (2017). https://doi.org/10.1109/MMM.2016.2635811.

  51. N.G. Weimann, D. Stoppel, M.I. Schukfeh, M. Hossain, T. Al-Sawaf, B. Janke, R. Doerner, S. Sinha, F.J. Schmückle, O. Krüger, V. Krozer, W. Heinrich, M. Lisker, A. Krüger, A. Datsuk, C. Meliani, B. Tillack, physica status solidi (a) 213(4), 909 (2016). https://doi.org/10.1002/pssa.201532549.

  52. N.G. Weimann, S. Monayakul, S. Sinha, F.J. Schmuckle, M. Hrobak, D. Stoppel, W. John, O. Kruger, R. Doerner, B. Janke, V. Krozer, W. Heinrich, IEEE Transactions on Components, Packaging and Manufacturing Technology 7(4), 494 (2017). https://doi.org/10.1109/TCPMT.2016.2636444.

  53. M. Hossain, N. Weimann, M. Lisker, C. Meliani, B. Tillack, V. Krozer, W. Heinrich, in 2015 IEEE MTT-S International Microwave Symposium (Phoenix, AZ, 2015). https://doi.org/10.1109/MWSYM.2015.7166907.

  54. A.D. Carter, M.E. Urteaga, Z.M. Griffith, K.J. Lee, J. Roderick, P. Rowell, J. Bergman, S. Hong, B. Patti, C. Petteway, G. Fountain, in 2017 IEEE MTT-S International Microwave Symposium (IMS) (2017), pp. 1760–1763. https://doi.org/10.1109/MWSYM.2017.8058986.

  55. M. Feiginov, C. Sydlo, O. Cojocari, P. Meissner, Applied Physics Letters 99(23), 233506 (2011).

  56. Y. Koyama, R. Sekiguchi, T. Ouchi, Applied Physics Express 6(6), 064102 (2013).

  57. T. Maekawa, H. Kanaya, S. Suzuki, M. Asada, Applied Physics Express 9(2), 024101 (2016).

  58. R. Izumi, S. Suzuki, M. Asada, in 2017 42nd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) (IEEE, 2017), pp. 1–2.

  59. M. Feiginov, Journal of Infrared, Millimeter, and Terahertz Waves 40(4), 365 (2019).

  60. H. Kanaya, T. Maekawa, S. Suzuki, M. Asada, Japanese Journal of Applied Physics 54(9), 094103 (2015).

  61. W. Prost, U. Auer, F.J. Tegude, C. Pacha, K.F. Goser, G. Janßen, T. Van Der Roer, International journal of circuit theory and applications 28(6), 537 (2000).

  62. K. Asakawa, Y. Itagaki, H. Shin-Ya, M. Saito, M. Suhara, IEICE transactions on electronics 95(8), 1376 (2012).

  63. R.A. York, T. Itoh, IEEE Transactions on Microwave Theory and Techniques 46(11), 1920 (1998).

  64. Y.T. Lo, J.F. Kiang, IEEE Transactions on Microwave Theory and Techniques 63(4), 1353 (2015).

  65. K. Arzi, S. Suzuki, A. Rennings, D. Erni, N. Weimann, M. Asada, W. Prost, IEEE Transactions on Terahertz Science and Technology 10(2), 221 (2020).

  66. K. Arzi, G. Keller, A. Rennings, D. Erni, F. Tegude, W. Prost, in 2017 10th UK-Europe-China Workshop on Millimetre Waves and Terahertz Technologies (UCMMT) (2017), pp. 1–4. https://doi.org/10.1109/UCMMT.2017.8068485.

  67. R. Adler, Proceedings of the IRE 34(6), 351 (1946).

  68. J.P. Guillet, B. Recur, L. Frederique, B. Bousquet, L. Canioni, I. Manek-Hönninger, P. Desbarats, P. Mounaix, Journal of Infrared, Millimeter, and Terahertz Waves 35(4), 382 (2014).

  69. P. Hillger, A. Schlüter, R. Jain, S. Malz, J. Grzyb, U. Pfeiffer, in 42nd Int. Conf. on Infrared, Millimeter, and Terahertz Waves (Cancun, Mexico, 2017), pp. 1–2. https://doi.org/10.1109/IRMMW-THz.2017.8067136.

  70. J. Kim, D. Yoon, J. Yun, K. Song, M. Kaynak, B. Tillack, J. Rieh, IEEE Transactions on Terahertz Science and Technology 8(5), 482 (2018). https://doi.org/10.1109/TTHZ.2018.2851542.

  71. J. Grzyb, M. Andree, R. Jain, B. Heinemann, U. Pfeiffer, IEEE Antennas and Wireless Propagation Letters pp. 1–1 (2019). https://doi.org/10.1109/LAWP.2019.2927300.

  72. M. Andree, J. Grzyb, R. Jain, B. Heinemann, U.R. Pfeiffer, in 2019 IEEE MTT-S International Microwave Symposium (IMS) (2019), pp. 500–503.

  73. M. González-Cardel, P. Arguijo, R. Díaz-Uribe, Appl. Opt. 52(16), 3849 (2013). https://doi.org/10.1364/AO.52.003849. http://ao.osa.org/abstract.cfm?URI=ao-52-16-3849.

  74. W. van Aarle, W.J. Palenstijn, J. De Beenhouwer, T. Altantzis, S. Bals, K.J. Batenburg, J. Sijbers, Ultramicroscopy 157, 35 (2015). https://doi.org/10.1016/J.ULTRAMIC.2015.05.002. https://www.sciencedirect.com/science/article/pii/S0304399115001060.

  75. G.C. Trichopoulos, K. Sertel, J. Infrared, Millimeter, and Terahertz Waves 36, 675 (2015). https://doi.org/10.1007/s10762-015-0144-x.

  76. J. Al-Eryani, H. Knapp, J. Kammerer, K. Aufinger, H. Li, L. Maurer, IEEE Transactions on Terahertz Science and Technology 8(3), 329 (2018).

  77. E. Fishler, A. Haimovich, R.S. Blum, L.J. Cimini, D. Chizhik, R.A. Valenzuela, IEEE Transactions on Signal Processing 54(3), 823 (2006).

  78. D. Bliss, K. Forsythe, in Signals, Systems and Computers, 2004. Conference Record of the Thirty-Seventh Asilomar Conference on, vol. 1 (IEEE, 2003), vol. 1, pp. 54–59.

  79. J. Li, P. Stoica, X. Zheng, IEEE Transactions on Signal Processing 56(8), 3959 (2008).

  80. A. Ganis, E.M. Navarro, B. Schoenlinner, U. Prechtel, A. Meusling, C. Heller, T. Spreng, J. Mietzner, C. Krimmer, B. Haeberle, et al., IEEE Transactions on Geoscience and Remote Sensing 56(1), 298 (2018).

  81. S. Kueppers, H. Cetinkaya, N. Pohl, in 2017 European Radar Conference (EURAD) (IEEE, 2017), pp. 122–125.

  82. R. Feger, C. Wagner, S. Schuster, S. Scheiblhofer, H. Jager, A. Stelzer, IEEE Transactions on Microwave Theory and Techniques 57(5), 1020 (2009).

  83. J. Li, P. Stoica, IEEE Signal Processing Magazine 24(5), 106 (2007). https://doi.org/10.1109/MSP.2007.904812.

  84. J. Li, Mimo radar-diversity means superiority. Tech. rep., FLORIDA UNIV GAINESVILLE DEPT OF ELECTRICAL AND COMPUTER ENGINEERING (2007).

  85. S. Haykin, IEEE Signal Processing Magazine 23(1), 30 (2006). https://doi.org/10.1109/MSP.2006.1593335.

  86. V.F. Mecca, D. Ramakrishnan, J.L. Krolik, in Fourth IEEE Workshop on Sensor Array and Multichannel Processing, 2006. (2006), pp. 249–253. https://doi.org/10.1109/SAM.2006.1706131.

  87. B. Welp, A. Meusling, K. Aufinger, N. Pohl, IEEE Transactions on Microwave Theory and Techniques 66(6), 2604 (2018).

  88. C. Wagner, M. Hartmann, A. Stelzer, H. Jaeger, IEEE microwave and wireless components letters 18(5), 362 (2008).

  89. U.R. Pfeiffer, E. Öjefors, Y. Zhao, in 2010 IEEE International Solid-State Circuits Conference-(ISSCC) (IEEE, 2010), pp. 416–417.

  90. D. Bleh, M. Roesch, M. Kuri, A. Dyck, A. Tessmann, A. Leuther, S. Wagner, O. Ambacher, in 2016 European Radar Conference (EuRAD) (IEEE, 2016), pp. 37–40.

  91. Y.L. Sit, G. Li, S. Manchala, H. Afrasiabi, C. Sturm, U. Lubbert, in 2018 15th European Radar Conference (EuRAD) (IEEE, 2018), pp. 289–292.

  92. K. Rambach, (2017).

  93. H. Yamada, M. Ohmiya, Y. Ogawa, K. Itoh, IEEE Transactions on Antennas and Propagation 39(2), 177 (1991).

  94. D. Oh, J. Lee, IEEE Sensors Journal 15(9), 4799 (2015).

  95. E. Miralles, T. Multerer, A. Ganis, B. Schoenlinner, U. Prechtel, A. Meusling, J. Mietzner, C. Weckerle, H. Esteban, M. Vossiek, et al., IEEE Aerospace and Electronic Systems Magazine 33(4), 46 (2018).

  96. R. Heimiller, J. Belyea, P. Tomlinson, IEEE Transactions on Aerospace and Electronic Systems (6), 831 (1983).

  97. H. Lebret, S. Boyd, IEEE transactions on signal processing 45(3), 526 (1997).

  98. W.Q. Wang, International Journal of Antennas and Propagation 2012 (2012).

  99. H. Cetinkaya, S. Kueppers, R. Herschel, N. Pohl, in 2016 10th European Conference on Antennas and Propagation (EuCAP) (IEEE, 2016), pp. 1–4.

  100. H.J. Ng, W. Ahmad, M. Kucharski, J.H. Lu, D. Kissinger, in Radio Frequency Integrated Circuits Symposium (RFIC), 2017 IEEE (IEEE, 2017), pp. 368–371.

  101. S. Yuan, H. Schumacher, in Bipolar/BiCMOS Circuits and Technology Meeting-BCTM, 2015 IEEE (IEEE, 2015), pp. 48–51.

  102. H.J. Ng, D. Kissinger, in Microwave Conference (APMC), 2017 IEEE Asia Pacific (IEEE, 2017), pp. 360–363.

  103. H.J. Ng, M. Kucharski, W. Ahmad, D. Kissinger, in 2017 18th International Radar Symposium (IRS) (IEEE, 2017), pp. 1–9.

  104. H.J. Ng, M. Kucharski, W. Ahmad, D. Kissinger, IEEE Journal of Solid-State Circuits 52(9), 2242 (2017).

  105. M. Kucharski, D. Kissinger, H.J. Ng, in 2018 22nd International Microwave and Radar Conference (MIKON) (IEEE, 2018), pp. 342–344.

  106. S.S. Ahmed, A. Genghammer, A. Schiessl, L.P. Schmidt, IEEE Transactions on Microwave Theory and Techniques 61(1), 651 (2013).

  107. K. Statnikov, J. Grzyb, B. Heinemann, U.R. Pfeiffer, 63(2), 520 (2015). https://doi.org/10.1109/TMTT.2014.2385777. http://ieeexplore.ieee.org/document/7004075/.

  108. H. Wang and C. Liu, in IET Int. Radar Conference (X an, CN, 2013), pp. 592–597.

  109. T. Xinguang, L. Xin, C. Hong and D. Miyi, Journal of Systems Engineering and Electronics 20(3), 485 (2009).

  110. Vol. G. Hasenaecker, M. van Delden, T. Jaeschke, N. Pohl, K. Aufinger and T. Musch, IEEE Trans. Microw. Theory Techn. 64(2), 847 (2016).

  111. E. N. Ivanov and M. E. Tobar, IEEE Trans. Ultrason., Ferroelectr., Freq. Control 56(2), 263 (2009).

  112. R. Feger, E. Kolmhofer, F. Starzer, F. Wiesinger, S. Scheiblhofer, and A. Stelzer, in 1IEEE Topical Conference on Wireless Sensors and Sensor Networks (Phoenix, AZ, 2011), pp. 9 – 12.

  113. T. Musch, in 26th European Microwave Conference (Prague, CZ, 1996), pp. 81–85.

  114. W. Stein, F. Huber, S. Bildik, M. Aigle and M. Vossiek, in 47th European Microwave Conference (Nuremberg, DE, 2017), pp. 767–770.

  115. M. van Delden, N. Pohl, K. Aufinger, C. Baer and T. Musch, IEEE Trans. Microw. Theory Techn. 0, 1 (2019).

  116. M. van Delden, N. Pohl and T. Musch, IEEE Trans. Microw. Theory Techn. 66(9), 3937 (2018).

  117. L. Polzin, M. van Delden and T. Musch, in 12th German Microwave Conference (Stuttgart, DE, 2019).

  118. A. Melzer, F. Starzer, H. Jäger, M. Huemer, IEEE Transactions on Circuits and Systems II: Express Briefs 64(7), 847 (2017).

  119. A.G. Stove, in IEE Proceedings F (Radar and Signal Processing), vol. 139 (IET, 1992), vol. 139, pp. 343–350.

  120. S. Ayhan, S. Scherr, A. Bhutani, B. Fischbach, M. Pauli, T. Zwick, IEEE Transactions on Microwave Theory and Techniques 64(10), 3290 (2016).

  121. S.O. Piper, in Proceedings International Radar Conference (IEEE, 1995), pp. 563–567.

  122. E. Ahmed, A.M. Eltawil, A. Sabharwal, in 2013 Asilomar Conference on Signals, Systems and Computers (IEEE, 2013), pp. 1199–1203.

  123. H. Vogt, G. Enzner, A. Sezgin, IEEE Transactions on Signal Processing 67(11), 2810 (2019). https://doi.org/10.1109/TSP.2019.2910490.

  124. N.N. Mai Khanh, K. Asada, in 2013 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) (2013), pp. 97–100. https://doi.org/10.1109/RFIC.2013.6569532.

  125. E. Everett, M. Duarte, C. Dick, A. Sabharwal, in 2011 Conference Record of the Forty Fifth Asilomar Conference on Signals, Systems and Computers (ASILOMAR) (IEEE, 2011), pp. 2002–2006.

  126. E. Everett, A. Sahai, A. Sabharwal, IEEE Transactions on Wireless Communications 13(2), 680 (2014).

  127. C.Y. Kim, J.G. Kim, J.H. Oum, J.R. Yang, D.K. Kim, J.H. Choi, S.W. Kwon, S.H. Jeon, J.W. Park, S. Hong, in 2006 IEEE MTT-S International Microwave Symposium Digest (IEEE, 2006), pp. 1402–1405.

  128. J.G. Kim, S. Ko, S. Jeon, J.W. Park, S. Hong, IEEE Microwave and wireless components letters 14(9), 443 (2004).

  129. K. Lin, Y.E. Wang, C.K. Pao, Y.C. Shih, IEEE Transactions on Microwave Theory and Techniques 54(12), 4041 (2006).

  130. A. Medra, D. Guermandi, K. Vaesen, S. Brebels, A. Bourdoux, W. Van Thillo, P. Wambacq, V. Giannini, IEEE Journal of Solid-State Circuits 51(5), 1141 (2016).

  131. M. Bauduin, A. Bourdoux, in 2018 15th European Radar Conference (EuRAD) (IEEE, 2018), pp. 293–296.

  132. D. Guermandi, Q. Shi, A. Medra, T. Murata, W. Van Thillo, A. Bourdoux, P. Wambacq, V. Giannini, in 2015 IEEE International Solid-State Circuits Conference-(ISSCC) Digest of Technical Papers (IEEE, 2015), pp. 1–3.

  133. A. Melzer, A. Onic, M. Huemer, in 2018 15th European Radar Conference (EuRAD) (2018), pp. 26–29. https://doi.org/10.23919/EuRAD.2018.8546548.

  134. J. Park, S. Park, D. Kim, S. Park, IEEE Transactions on Microwave Theory and Techniques pp. 1–12 (2019). https://doi.org/10.1109/TMTT.2018.2889045.

  135. J. Park, S. Park, S.O. Park, arXiv:1807.06324 (2018).

  136. D. Korpi, T. Riihonen, V. Syrjälä, L. Anttila, M. Valkama, R. Wichman, 13(7), 3821 (2014). https://doi.org/10.1109/TWC.2014.2315213.

  137. C.M. Bishop, Pattern Recognition and Machine Learning (Information Science and Statistics) (Springer-Verlag New York, Inc., Secaucus, NJ, USA, 2006).

  138. D. Korpi, Y.S. Choi, T. Huusari, L. Anttila, S. Talwar, M. Valkama, in IEEE Global Communications Conf. (2015), pp. 1–7.

  139. K. Komatsu, Y. Miyaji, H. Uehara, 17(6), 3768 (2018). https://doi.org/10.1109/TWC.2018.2816061.

  140. S. Malik, G. Enzner, 20(7), 2065 (2012).

Download references

Acknowledgments

We gratefully acknowledge that Masahiro Asada and Safumi Suzuki, both from Tokyo Institute of Technology, Japan, provided the packaged RTD source used for tomography measurements.

Funding

Funded by the Deutsche Forschungsgemeinschaft —Project-ID 287022738—TRR 196; Projects C01, C02, C03, C04, C05, C08, C11, S02, and S03.

Author information

Authors and Affiliations

  1. Institute for High-Frequency and Communication Technology, Rainer-Grünter-Straße 21, 42119, Wuppertal, Germany

    Philipp Hillger, Marcel Andree & Ullrich R. Pfeiffer

  2. Institute of Electronic Circuits, Universitätsstraße 150, 44801, Bochum, Germany

    Marcel van Delden & Thomas Musch

  3. Chair for Integrated Systems, Universitätsstraße 150, 44801, Bochum, Germany

    Jonathan Wittemeier & Nils Pohl

  4. Institute for Digital Communications Systems, Universitätsstraße 150, 44801, Bochum, Germany

    Udaya Sampath Miriya Thanthrige, Aya Mostafa Ahmed & Aydin Sezgin

  5. General and Theoretical Electrical Engineering (ATE), University of Duisburg-Essen, 47048, Duisburg, Germany

    Benedikt Sievert, Andreas Rennings & Daniel Erni

  6. Solid-State Electronics Department, Lothartraße 55, 47048, Duisburg, Germany

    Khaled Arzi, Werner Prost & Nils Weimann

Authors
  1. Philipp Hillger
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Marcel van Delden
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Udaya Sampath Miriya Thanthrige
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Aya Mostafa Ahmed
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Jonathan Wittemeier
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Khaled Arzi
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. Marcel Andree
    View author publications

    You can also search for this author in PubMed Google Scholar

  8. Benedikt Sievert
    View author publications

    You can also search for this author in PubMed Google Scholar

  9. Werner Prost
    View author publications

    You can also search for this author in PubMed Google Scholar

  10. Andreas Rennings
    View author publications

    You can also search for this author in PubMed Google Scholar

  11. Daniel Erni
    View author publications

    You can also search for this author in PubMed Google Scholar

  12. Thomas Musch
    View author publications

    You can also search for this author in PubMed Google Scholar

  13. Nils Weimann
    View author publications

    You can also search for this author in PubMed Google Scholar

  14. Aydin Sezgin
    View author publications

    You can also search for this author in PubMed Google Scholar

  15. Nils Pohl
    View author publications

    You can also search for this author in PubMed Google Scholar

  16. Ullrich R. Pfeiffer
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Philipp Hillger.

Additional information

Publisher’s Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Springer Nature or its licensor holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Hillger, P., van Delden, M., Thanthrige, U.S.M. et al. Toward Mobile Integrated Electronic Systems at THz Frequencies. J Infrared Milli Terahz Waves 41, 846–869 (2020). https://doi.org/10.1007/s10762-020-00699-x

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10762-020-00699-x

Keywords

Search

Navigation