The ever decreasing geometrical dimensions of electronic devices makes miscellaneous cables or connectors of relatively large dimensions unwanted. Thus, wireless inter/intra-device communications in the millimeter-wave range become a topic of recent interest. In this paper, the excess losses of three groups of typical semi-closed obstacles (connectors, heatsinks, and printed circuit boards) in inter/intra-device communications are measured and empirically modeled. Specific coefficients for each of the obstacles are estimated to describe the excess loss in the millimeter-wave band. Validation shows that the empirical model structure combined with the specific coefficients can provide an effective and simple way to include various semi-closed obstacles in the network planning, simulation, and design of inter/intra-device communications.
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The authors would like to thank Prof. Jörg Schöbel from the Institut für Hochfrequenztechnik at Technische Universität Braunschweig, Germany for providing the W-Band measurement equipment and complementary accessories.
This work is supported by the NNSF of China under Grant U1334202 and 61501021, the ZTE corporation, 863 project under Grant 2014AA01A706, and State Key Lab of Rail Traffic Control and Safety Project under Grant RCS2015ZZ001.
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Guan, K., Ai, B., Fricke, A. et al. Excess Propagation Loss of Semi-Closed Obstacles for Inter/Intra-Device Communications in the Millimeter-Wave Range. J Infrared Milli Terahz Waves 37, 676–690 (2016). https://doi.org/10.1007/s10762-016-0251-3