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Investigation of Laser Technology for Cutting Mica

Glass and Ceramics volume 78, pages 486–489 (2022)Cite this article

The results of an investigation of the process of cutting mica using ultrashort pulsed pico- and femtosecond laser radiation with wavelength 1030 nm are reported. The pulses were focused by a lens with a small numerical aperture (numerical aperture < 0.1). Optimization of the conditions for achieving large-scale processing without micron-size microcracks along the edges and walls is performed at different pulse durations, pulse energies, and scanning speeds. Samples with thickness 0.1 – 0.2 mm were cut out, and the desired result was achieved without visible heat-affected zones. It was determined that when mica processing is needed in mass production it is essential to use a system for real-time tracking of the sample surface in order to adjust the position of the focus on the entire sheet.

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Authors and Affiliations

  1. MIREA – Russian Technological University, Moscow, Russia

    V. S. Kondratenko

  2. SPC Lasers and Equipment TM, LLC, Moscow, Russia

    D. L. Saprykin, O. N. Tretiyakova & D. N. Tuzhilin

  3. MAI – Moscow Aviation Institute (National Research University), Moscow, Russia

    O. N. Tretiyakova

Authors
  1. V. S. Kondratenko
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  2. D. L. Saprykin
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  3. O. N. Tretiyakova
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  4. D. N. Tuzhilin
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Correspondence to V. S. Kondratenko.

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Translated from Steklo i Keramika, No. 12, pp. 27 – 31, December, 2021.

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Kondratenko, V.S., Saprykin, D.L., Tretiyakova, O.N. et al. Investigation of Laser Technology for Cutting Mica. Glass Ceram 78, 486–489 (2022). https://doi.org/10.1007/s10717-022-00437-w

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  • DOI: https://doi.org/10.1007/s10717-022-00437-w

Key words

  • laser cutting
  • picosecond laser
  • mica
  • laser systems
  • tracking of the surface