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In-situ dwell-fatigue fracture experiment and CPFE simulation of SLM AlSi10Mg alloy at high temperature

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Abstract

The creep-fatigue fracture behavior of selective laser melting (SLM) AlSi10Mg alloy was studied by conducting in-situ scanning electron microscopy experiments at 500 °C. Dwell times of 0, 60 and 120 s were introduced to the tensile-tensile fatigue. The experimental results indicated that the lifetime decreased with lengthening of the dwell time from 0 to 120 s, which closely related to the deformation response behavior of the material. The process of the fracture evolution of the alloy was characterized and analyzed using in-situ scanning electron microscopy images and the fracture morphology. The creep-fatigue fracture mechanism of SLM AlSi10Mg alloy was revealed. Finally, combined with crystal plasticity finite element simulation, the Mises stress, plastic strain and elastic stored energy were used to explain the crack nucleation of SLM AlSi10Mg alloy under fatigue and dwell-fatigue.

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Acknowledgements

This work was financially supported by the National Natural Science Foundation of China (Grant Numbers 11632010, 11872035 and 12172190).

Funding

Funding was provided by National Natural Science Foundation of China (Grant Numbers 11632010, 11872035, 12172190).

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Author notes

  1. Zhen Wang and Chong Zhao have contributed equally to this work.

Authors and Affiliations

  1. Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China

    Zhen Wang, Chong Zhao, Jie Wang & Xide Li

  2. State Key Laboratory for Nonlinear Mechanics (LNM), Institute of Mechanics, Chinese Academy of Sciences, Beijing, 100190, China

    Zhen Wang

  3. Institute of Advanced Structure &Technology, Beijing Institute of Technology, Beijing, 100081, China

    Wenwang Wu

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  1. Zhen Wang
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  2. Chong Zhao
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  3. Jie Wang
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  5. Xide Li
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Correspondence to Xide Li.

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Wang, Z., Zhao, C., Wang, J. et al. In-situ dwell-fatigue fracture experiment and CPFE simulation of SLM AlSi10Mg alloy at high temperature. Int J Fract 235, 159–178 (2022). https://doi.org/10.1007/s10704-022-00647-x

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