Abstract
Thermal response of the honeycomb sandwich structure was evaluated using the steady-state method at different temperatures ranging from 100°C to 400°C. The results showed that effective thermal conductivity decreases when the temperature set is over 300°C, and the critical temperature is about 310°C. As a result, a set of experiments was conducted to observe the inner structure of the sandwich in a quest to understand why the thermal conductivity decreases. A black substance was found, and it adhered to the interfaces between the faces and the core where the adhesive is located. A series of experiments were carried out to study the thermal response of the adhesive. The TG curves showed that the total mass loss of adhesive can reach 90% due to the thermal decomposition, which can absorb a portion of energy. Meanwhile, the black substance was also produced during the TG measurements and its carbon content reached 64.38%.
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31 May 2021
A Correction to this paper has been published: https://doi.org/10.1007/s10694-021-01142-w
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This work was supported by the National Key Research and Development Program of China (2016YFB1200505 and 2016YFB1200403).
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Yuan, R., Zhang, Y., Qin, Y. et al. Study on Thermal Response of Adhesively Bonded Honeycomb Sandwich Structure in High Temperature. Fire Technol 57, 1135–1147 (2021). https://doi.org/10.1007/s10694-020-01033-6
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DOI: https://doi.org/10.1007/s10694-020-01033-6