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Numerical solutions of singular integral equations for planar rectangular interfacial crack in three dimensional bimaterials

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Abstract

Stress intensity factors for a three dimensional rectangular interfacial crack were considered using the body force method. In the numerical calculations, unknown body force densities were approximated by the products of the fundamental densities and power series; here the fundamental densities are chosen to express singular stress fields due to an interface crack exactly. The calculation shows that the numerical results are satisfied. The stress intensity factors for a rectangular interface crack were indicated accurately with the varying aspect ratio, and bimaterial parameter.

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Authors and Affiliations

  1. College of Science, China Agricultural University, Beijing, 100083, P. R. China

    Xu Chun-hui  (徐春晖) & Qin Tai-yan  (秦太验) (Associate Professor, Doctor)

  2. Department of Mechanical Engineering, Kyushu Institute of Technology, Kitakyushu, 804-8550, Japan

    Nao-Aki Noda  (野田尚昭)

Authors
  1. Xu Chun-hui  (徐春晖)
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  2. Qin Tai-yan  (秦太验)
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  3. Nao-Aki Noda  (野田尚昭)
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Corresponding author

Correspondence to Qin Tai-yan  (秦太验).

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Communicated by WANG Yin-bang

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Xu, Ch., Qin, Ty. & Noda, NA. Numerical solutions of singular integral equations for planar rectangular interfacial crack in three dimensional bimaterials. Appl Math Mech 28, 751–757 (2007). https://doi.org/10.1007/s10483-007-0605-y

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  • DOI: https://doi.org/10.1007/s10483-007-0605-y

Key words

Chinese Library Classification

2000 Mathematics Subject Classification

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