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Investigation of on-chip integrated inductors fabricated in SOI-MUMPs for RF MEMS ICs

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Abstract

This paper presents for the first time implementation of zig–zag and solenoidal on-chip inductors in standard and cost effective SOI-MUMPs fabrication process. The solenoidal inductor offers high Q-factor and inductance as compared to planar zig–zag inductor. Bonding wires are used to construct the top conductor loop of the solenoidal inductor. The inductors are also characterized at elevated temperature for performance investigation in harsh environment. The mechanical resonance frequency of the inductors are characterized using the Finite element software COMSOL. The inductors are characterized using a vector network analyzer from 60 MHz to 3 GHz, and the results of both inductors are compared. The total size of the device is 2 × 0.7 mm2.

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Acknowledgements

We acknowledge the financial support from King Abdullah University of Science and Technology (KAUST).

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  1. Physical Sciences and Engineering Division, King Abdullah University of Science and Technology, Thuwal, 23955-6900, Saudi Arabia

    Fahimullah Khan & M. I. Younis

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  1. Fahimullah Khan
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  2. M. I. Younis
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Correspondence to M. I. Younis.

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Khan, F., Younis, M.I. Investigation of on-chip integrated inductors fabricated in SOI-MUMPs for RF MEMS ICs. Analog Integr Circ Sig Process 102, 585–591 (2020). https://doi.org/10.1007/s10470-020-01627-8

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