Skip to main content
SpringerLink
Log in

Study of the index failure for power amplifier caused by temperature

  • Published:
Analog Integrated Circuits and Signal Processing Aims and scope Submit manuscript

Abstract

A systematic study of the index failure for RF circuit subjected to temperature stress is presented in this paper. The effect of the temperature stress on the performance indexes such as S21, bandwidth, output power is examined. A broadband power amplifier is taken as a example to study the index failure. The performance degradation is demonstrated and analysed by conducting some step-stress ADT.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11

Similar content being viewed by others

References

  1. Peng, C. Y., & Tseng, S. T. (2010). Progressive-stress accelerated degradation test for highly-reliable products. IEEE Transactions on Reliability, 59(1), 30–37.

    Article  MathSciNet  Google Scholar 

  2. Crk, V. (2000). Reliability assessment from degradation data. In Proceedings of Annual Reliability and Maintainability Symposium (pp. 155–161).

  3. Sharma, V., & Chandel, S. S. (2013). Performance and degradation analysis for long term reliability of solar photovoltaic systems: A review. Renewable and Sustainable Energy Reviews, 27(11), 753–767.

    Article  Google Scholar 

  4. Yang, G. (2012). Optimum degradation tests for comparison of products. IEEE Transactions on Reliability, 61(1), 220–226.

    Article  Google Scholar 

  5. Zhao, W., & Elsayed, E. A. (2004). An accelerated life testing model involving performance degradation. In Reliability and Maintainability Annual Symposium (pp. 324–329).

  6. Kim, Y. T., Kim, K.-B., Hyun, Y, E., Kim, I.-J., & Yang, S. (2015). Simulation study on the lifetime of electrochemical capacitors using the accelerated degradation test under temperature and voltage stresses. Microelectronics Reliability, 55(12), 2712–2720.

    Article  Google Scholar 

  7. Nelson, W. (1981). Analysis of performance degradation data from accelerated tests. IEEE Transactions on Reliability R, 30(2), 149–155.

    Article  MATH  Google Scholar 

  8. Lu, C. J., & Meeker, W. Q. (1993). Using degradation measures to estimate a time-to-failure distribution. Technometrics, 35(5), 161–174.

    Article  MathSciNet  MATH  Google Scholar 

  9. Meeker, W. Q., & Escobar, L. A. (1998). Pitfalls of accelerated testing. IEEE Transactions on Reliability, 47(2), 114–118.

    Article  MathSciNet  Google Scholar 

  10. Chinnam, R. B. (1999). On-line reliability estimation of individual components using degradation signals. IEEE Transactions on Reliability, 48(4), 403–412.

    Article  Google Scholar 

  11. Lu, H., Kolarik, W. J., & Lu, S. (2001). Real-time performance reliability prediction. IEEE Transactions on Reliability, 50(4), 353–357.

    Article  Google Scholar 

  12. Lu, S., Lu, H., & Kolarik, W. (2001). Multivariate performance reliability prediction in real-time. Reliability Engineering and System Safety, 72(3), 39–45.

    Article  Google Scholar 

  13. Joseph, V. R., & Yu, I. T. (2006). Reliability improvement experiments with degradation data. IEEE Transactions on Reliability, 55(1), 149–157.

    Article  Google Scholar 

  14. Hua, C., Zhang, Q., Guanghua, X., Zhang, Y., & Tao, X. (2013). Performance reliability estimation method based on adaptive failure threshold. Mechanical Systems and Signal Processing, 36(2), 505–519.

    Article  Google Scholar 

  15. Meyer, E. L., & van Dyk, E. E. (2004). Assessing the reliability and degradation of photovoltaic module performance parameters. IEEE Transactions on Reliability, 53(1), 83–92.

    Article  Google Scholar 

  16. Haghighi, F., & Bae, S. J. (2015). Reliability estimation from linear degradation and failure time data with competing risks under a step-stress accelerated degradation test. IEEE Transactions on Reliability, 64(30), 960–971.

    Article  Google Scholar 

  17. Tseng, S. T., Balakrishnan, N., & Tsai, C. C. (2009). Optimal step-stress accelerated degradation test plan for gamma degradation processes. IEEE Transactions on Reliability, 58(4), 611–618.

    Article  Google Scholar 

  18. Deng, A. M., Chen, X., Zhang, C. H., & Wang, Y. S. (2006). Reliability assessment based on performance accelerated degradation data. Journal of Projectiles, Rockets, Missiles and Guidance, 26(2), 808–815.

    Google Scholar 

  19. Deng, A. M., Chen, X., Zhang, C. H., & Wang, Y. S. (2007). A comprehensive review of accelerated degradation testing. Acta Armamentarii, 28(8), 1002–1007.

    Google Scholar 

  20. Zhao, J. Y., & Liu, F. (2008). Models and statistical analysis for accelerated degradation test. Journal of Harbin Institute of Technology, 40(12), 2088–2091.

    Google Scholar 

  21. Cai, M., Yang, D., Tian, K., Zhang, P., Chen, X., Liu, L., et al. (2015). Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method. Microelectronics Reliability, 55(9–10), 1784–1789.

    Article  Google Scholar 

  22. Belaid, M. A., Ketata, K., Mourgues, K., Maanane, H., Masmoudi, M., & Marcon, J. (2005). Comparative analysis of accelerated ageing effects on power RF LDMOS reliability. Microelectronics Reliability, 45(3), 1732–1737.

    Article  Google Scholar 

Download references

Acknowledgments

This work was supported by the 863 Program of China (Grant No. 2015AA01A703) and the Tianjin University-Qinghai University for Nationalities independent innovation fund cooperation project(2015).

Author information

Authors and Affiliations

  1. School of Electronic Information Engineering, Tianjin University, 300072, Tianjin, China

    Qian Lin, Haipeng Fu, Qianfu Cheng & Yuanyuan Zhu

  2. College of Physics and Electronic Information Engineer, Qinghai University for Nationalities, 810007, Qinghai, China

    Qian Lin

Authors
  1. Qian Lin
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Haipeng Fu
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Qianfu Cheng
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yuanyuan Zhu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Haipeng Fu.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Lin, Q., Fu, H., Cheng, Q. et al. Study of the index failure for power amplifier caused by temperature. Analog Integr Circ Sig Process 89, 177–183 (2016). https://doi.org/10.1007/s10470-016-0807-0

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10470-016-0807-0

Keywords

Search

Navigation