Interconnection blocks with minimal dead volumes permitting planar interconnection to thin microfluidic devices

Abstract

We have previously described ‘Interconnection Blocks’ which are re-usable, non-integrated PDMS blocks which allowing multiple, aligned and planar microfluidic interconnections. Here, we describe Interconnection Block versions with zero dead volumes that allow fluidic interfacing to flat or thin side-walled microfluidic devices. These designs increase the number of materials, types of devices and applications for which Interconnection Blocks can be used. Average leak pressures of 4.7 bar were recorded and all individual leak pressures recorded were above the 2-bar threshold for microfluidic applications. Additionally, the new Interconnection Block designs demonstrate that micromilling, a practical microfabrication method, can produce useful geometries not readily made through clean room-based approaches.