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Frictionless Multi-field Coupling Contact Problem for a Thermoelectric Layer Loaded by Two Rigid Punches

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Abstract

In this paper, the thermo-electro-mechanical coupling contact problem of thermoelectric material with double punches is analyzed accurately. Using the Fourier cosine transform technique, the thermo-electro-elastic problem is transformed into three sets of singular integral equations, which are numerically solved by the Gauss–Chebyshev integral formula according to the unknown normal electric current density, normal energy flux and normal contact stress. For a rigid flat indenter, the results can be covered by the degradation results of two rigid flat indenters. The numerical results reveal the interaction between two punches and the effect of thermoelectric load on the indentation behaviors. The interaction between the two punches reduces the contact pressure at the inner edge of the indenter as the thermoelectric load increases while increasing the stress singularity at the outer edge. The change of punches’ spacing makes the singularity of normal stress at the inner and outer edges asymmetric. The results provide an in-depth understanding of the multi-region contact damage mechanism of thermoelectric material.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (Nos. 11762016, 12062021, and 12062022), Ningxia Hui Autonomous Region Science and Technology Innovation Leading Talent Training Project (KJT2020001), and the Natural Science Foundation of Ningxia (2022AAC03068, 2022AAC03001).

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Authors and Affiliations

  1. School of Mathematics and Statistics, Ningxia University, Yinchuan, 750021, China

    Yali Zhang, Hailiang Ma & Shenghu Ding

  2. School of Ethnic Preparatory Education, Ningxia University, Yinchuan, 750021, China

    Juan Yang

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  1. Yali Zhang
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  3. Juan Yang
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  4. Shenghu Ding
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Contributions

YZ: Formal analysis, investigation, writing—original draft, writing—review and editing. HM: Conceptualization, formal analysis, software. JY: Conceptualization, formal analysis, software. SD: Conceptualization, methodology, formal analysis, investigation, writing—original draft, writing—review and editing, funding acquisition, supervision.

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Correspondence to Shenghu Ding.

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The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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Zhang, Y., Ma, H., Yang, J. et al. Frictionless Multi-field Coupling Contact Problem for a Thermoelectric Layer Loaded by Two Rigid Punches. Acta Mech. Solida Sin. 36, 282–292 (2023). https://doi.org/10.1007/s10338-022-00355-y

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