Advertisement

Acta Mechanica Solida Sinica

, Volume 21, Issue 3, pp 198–206 | Cite as

Determination of Interfacial Mechanical Parameters for an Al/Epoxy/Al2O3 System by Using Peel Test Simulations

  • Xuemei You
  • Haifeng Zhao
  • Yueguang Wei
Article

Abstract

Peel test measurements and simulations of the interfacial mechanical parameters for the Al/Epoxy/Al2O3 system are performed in the present investigation. A series of Al film thicknesses between 20 and 250 microns and three peel angles of 90, 135 and 180 degrees are considered. Two types of epoxy adhesives are adopted to obtain both strong and weak interface adhesions. A finite element model with cohesive zone elements is used to identify the interfacial parameters and simulate the peel test process. By simulating and recording normal stress near the crack tip, the separation strength is obtained. Furthermore, the cohesive energy is identified by comparing the simulated steady-state peel force and the experimental result. It is found from the research that both the cohesive energy and the separation strength can be taken as the intrinsic interfacial parameters which are dependent on the thickness of the adhesive layer and independent of the film thickness and peel angle.

Key Words

peel test interface toughness cohesive zone model energy release rate 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. [1]
    Cotterell, B., Hbaieb, K., Williams, J.G., Hadavinia, H. and Tropsa, V., The root rotation in double cantilever beam and peel tests. Mechanics of Materials, 2006, 38: 571–580.CrossRefGoogle Scholar
  2. [2]
    Hadavinia, H., Kawashita, L., Kinloch, A.J., Moore, D.R. and Williams, J.G., A numerical analysis of the elastic-plastic peel test. Engineering Fracture Mechanics, 2006, 73(16): 2324–2335.CrossRefGoogle Scholar
  3. [3]
    Pardoen, T., Ferracin, T., Landis, C.M. and Delannay, F., Constraints effects in adhesive joint fracture. Journal of the Mechanics and Physics of Solids, 2005, 53: 1951–1983.CrossRefGoogle Scholar
  4. [4]
    Wei, Y., Thin layer splitting along the elastic-plastic solid surface. International Journal of Fracture, 2002, 113: 233–252.CrossRefGoogle Scholar
  5. [5]
    Wei, Y., Modeling nonlinear peeling of ductile thin films — critical assessment of analytical bending models using FE simulations. International Journal of Solids and Structures, 2004, 41: 5087–5104.CrossRefGoogle Scholar
  6. [6]
    Cui, J., Wang, R., Sinclair, A.N. and Spelt, J.K., A calibrated finite element model of adhesive peeling. International Journal of Adhesion & Adhesives, 2003, 23: 199–206.CrossRefGoogle Scholar
  7. [7]
    Song, J.Y. and Jin, Y., Analysis of the T-peel strength in a Cu/Cr/Polyimide system. Acta Materialia, 2002, 50: 3985.CrossRefGoogle Scholar
  8. [8]
    Yang, Q.D. and Thouless, M.D., Mixed-mode fracture analyses of plastically-deforming adhesive joints. International Journal of Fracture, 2001, 110: 175–187.CrossRefGoogle Scholar
  9. [9]
    Yang, Q.D., Thouless, M.D. and Ward, S.M., Numerical simulations of adhesively-bonded beams failing with extensive plastic deformation. Journal of the Mechanics and Physics of Solids, 1999, 47: 1337–1353.CrossRefGoogle Scholar
  10. [10]
    Yang, Q.D., Thouless, M.D. and Ward, S.M., Elastic-plastic mode-II fracture of adhesive joints. International Journal of Solids and Structures, 2001, 38: 3251–3262.CrossRefGoogle Scholar
  11. [11]
    Park, I.S. and Jin, Y., An X-ray study on the mechanical effects of the peel test in a Cu/Cr/Polyimide system. Acta Materialia, 1998, 46: 2947–2953.CrossRefGoogle Scholar
  12. [12]
    Park, Y.B., Park, I.S. and Jin, Y., Interfacial fracture energy measurement in the Cu/Cr/Polyimide system. Materials Science & Engineering A, 1999, 266: 261–266.CrossRefGoogle Scholar
  13. [13]
    Asai, H., Iwase, N. and Suga, T., Influence of ceramic surface treatment on peel-off strength between aluminum nitride and epoxy-modified polyaminobismaleimide adhesive. IEEE Trans Adv Pack, 2001, 24: 104–112.CrossRefGoogle Scholar
  14. [14]
    Bundy, K., Schlegel, U., Rahn, B., Geret, V. and Perren, S., Improved peel test method for measurement of adhesion to biomaterials. Journal of Materials Science: Materials in Medicine, 2000, 11: 517–521.Google Scholar
  15. [15]
    Dillard, D.A. and Pocius, A.V., The Mechanics of Adhesion. Elsevier Press, 2002.Google Scholar
  16. [16]
    Ferracin, T., Landis, C.M., Delannay, F. and Pardoen, T., On the determination of the cohesive zone properties of an adhesive layer from the analysis of the wedge-peel test. International Journal of Solids and Structures, 2003, 40: 2889–2904.CrossRefGoogle Scholar
  17. [17]
    Wei, Y. and Hutchinson, J.W., Interface strength, work of adhesion and plasticity in the peel test. International Journal of Fracture, 1998, 93: 315–333.CrossRefGoogle Scholar
  18. [18]
    Kim, K.S. and Aravas, N., Elasto-plastic analysis of the peel test. International Journal of Solids and Structures, 1988, 24: 417–435.CrossRefGoogle Scholar
  19. [19]
    Kinloch, A.J., Lau, C.C. and Williams, J.G., The peeling of flexible laminates. International Journal of Fracture, 1994, 66: 45–70.CrossRefGoogle Scholar
  20. [20]
    Kim, J., Kim, K.S. and Kim, Y.H., Mechanical effects of peel adhesion test. Journal of Adhesion Science and Technology, 1989, 3: 175–187.CrossRefGoogle Scholar
  21. [21]
    Wei, Y., Zhao, H. and Cao, A., Modeling and measurement of plastic dissipation in micron-thickness thin film peeling. The 12th International Symposium on Plasticity, Halifax, Canada, 2006, July 17–22.Google Scholar
  22. [22]
    Moidu, A.K., Sinclair, A.N. and Spelt, J.K., Analysis of the peel test: prediction of adherend plastic dissipation and extraction of fracture energy in metal-to-metal adhesive joints. Journal of Testing and Evaluation, 1995, 23: 241–253.CrossRefGoogle Scholar
  23. [23]
    Moidu, A.K., Sinclair, A.N. and Spelt, J.K., On the determination of fracture energy using the peel test. Journal of Testing and Evaluation, 1998, 26: 247–254.CrossRefGoogle Scholar
  24. [24]
    Wei, Y. and Zhao, H., Peeling experiments of ductile thin films along ceramic substrates — critical assessment of analytical models. International Journal of Solids & Structures, 2008, 45: 3779–3792.CrossRefGoogle Scholar
  25. [25]
    Zhao, H. and Wei, Y., Determination of interface properties between micron-thick metal film and ceramic substrate using peel test. International Journal of Fracture, 2007, 144: 103–112.CrossRefGoogle Scholar
  26. [26]
    Zhao, H. and Wei, Y., Inverse analysis to determine interfacial properties between metal film and ceramic substrate with an adhesive layer. Acta Mechanica Sinica, 2008, 24: 297–303.CrossRefGoogle Scholar
  27. [27]
    Wei, Y., A new finite element method for strain gradient theories and applications to fracture analyses. European Journal of Mechanics A/Solids, 2006, 25: 897–913.MathSciNetCrossRefGoogle Scholar
  28. [28]
    Tvergaard, V. and Hutchinson, J.W., The influence of plasticity on mixed mode interface fracture. Journal of the Mechanics and Physics of Solids, 1993, 41: 1119–1135.CrossRefGoogle Scholar
  29. [29]
    Wei, Y. and Hutchinson, J.W., Nonlinear delamination mechanics for thin films. Journal of the Mechanics and Physics of Solids, 1997, 45: 1137–1159.CrossRefGoogle Scholar

Copyright information

© The Chinese Society of Theoretical and Applied Mechanics and Technology 2008

Authors and Affiliations

  1. 1.State-Key Laboratory of Nonlinear MechanicsInstitute of Mechanics, Chinese Academy of ScienceBeijingChina

Personalised recommendations