Pulverization of waste printed circuit boards

Abstract

A new pulverization method to reduce the volume of waste printed circuit boards is reported. About 50% of printed circuit boards with integrate circuits (ICs) could be pulverized by our method in one 20-min batch, but boards without ICs could not be pulverized. By repeating the process three times, about 95% of printed circuit boards with ICs could be made into a fine powder with particles less than 106 µm. A weight-drop test was also performed to examine the strength of the printed circuit boards and clarify the mechanism of pulverization. When a weight was dropped on the solder-welding side of the board ruptures occurred more easily than when the weight was dropped on the IC-mounted side. With a heavy weight, the IC was fractured more easily when the potential energy was low. Where the stress was concentrated, two types of rupture location were found on printed circuit boards with ICs. One was where the IC was connected to the printed circuit board. The other was where the surface had undulations. It also became clear that the fracture of printed circuit boards depends on the impacting weight rather than on the potential energy.