Abstract
This work proposes a facile fabrication strategy for thermally conductive graphite nanosheets/poly(lactic acid) sheets with ordered GNPs (o-GNPs/PLA) via fused deposition modeling (FDM) 3D printing technology. Further combinations of o-GNPs/PLA with Ti3C2Tx films prepared by vacuum-assisted filtration were carried out by “layer-by-layer stacking-hot pressing” to be the thermally conductive Ti3C2Tx/(o-GNPs/PLA) composites with superior electromagnetic interference shielding effectiveness (EMI SE). When the content of GNPs was 18.60 wt% and 4 layers of Ti3C2Tx (6.98 wt%) films were embedded, the in-plane thermal conductivity coefficient (λ||) and EMI SE (EMI SE||) values of the thermally conductive Ti3C2Tx/(o-GNPs/PLA) composites significantly increased to 3.44 W·m–1·K–1 and 65 dB (3.00 mm), increased by 1223.1% and 2066.7%, respectively, compared with λ|| (0.26 W·m–1·K–1 ) and EMI SE|| (3 dB) of neat PLA matrix. This work offers a novel and easily route for designing and manufacturing highly thermally conductive polymer composites with superior EMI SE for broader application.
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Acknowledgments
The authors are grateful for the financial support from the National Natural Science Foundation of China (Nos. 51773169 and 51973173); Technical Basis Scientific Research Project (Highly Thermally Conductive Non-metal Materials); Guangdong Basic and Applied Basic Research Foundation (No. 2019B1515120093); Natural Science Basic Research Plan for Distinguished Young Scholars in Shaanxi Province of China (No. 2019JC-11). This work was also financially supported by Polymer Electromagnetic Functional Materials Innovation Team of Shaanxi Sanqin Scholars.
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Invited Research Article for the 40th Anniversary of Chinese Journal of Polymer Science
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Thermally Conductive Poly(lactic acid) Composites with Superior Electromagnetic Shielding Performances via 3D Printing Technology
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Ma, TB., Ma, H., Ruan, KP. et al. Thermally Conductive Poly(lactic acid) Composites with Superior Electromagnetic Shielding Performances via 3D Printing Technology. Chin J Polym Sci 40, 248–255 (2022). https://doi.org/10.1007/s10118-022-2673-9
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DOI: https://doi.org/10.1007/s10118-022-2673-9