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Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application

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Abstract

To meet the processing requirements of resin transfer moulding (RTM) technology, reactive diluent containing m-phenylene moiety was synthesized to physically mixed with phenylethynyl terminated cooligoimides with well-designed molecular weights of 1500–2500 g/mol derived from 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA), 3,4′-oxydianiline (3,4′-ODA) and m-phenylenediamine (m-PDA). This blend shows low minimum melting viscosity (<1 Pa·s) and enlarged processing temperature window (260–361 °C). FPI-R-1 stays below 1 Pa·s for 2 h at 270 °C. The relationship between the molecular weight of the blend and its melting stability was first explored. Blending oligoimides with lower molecular weights exhibit better melting stability. Upon curing at 380 °C for 2 h, the thermosetting polyimide resin demonstrates superior heat resistance (Tg=420–426 °C).

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Acknowledgments

This work was financially supported by the National Natural Science Foundation of China (No. 51803222) and Science and Technology Service Network Initiative, Chinese Academy of Sciences.

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Authors and Affiliations

  1. Key Laboratory of Science and Technology on High-tech Polymer Materials, Chinese Academy of Sciences, Beijing, 100190, China

    Wei-Jie Hong, Li-Li Yuan, Hao-Yang Zhang & Shi-Yong Yang

  2. School of Chemical Engineering, University of Chinese Academy of Sciences, Beijing, 100049, China

    Wei-Jie Hong, Hao-Yang Zhang & Shi-Yong Yang

  3. Astronautical Systems Engineering Technology, Beijing, 100076, China

    Chao Cui

  4. Aerospace Research Institute of Materials & Processing Technology, Beijing, 100076, China

    Wei Chen

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  1. Wei-Jie Hong
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  2. Li-Li Yuan
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Hong, WJ., Yuan, LL., Zhang, HY. et al. Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application. Chin J Polym Sci 40, 107–120 (2022). https://doi.org/10.1007/s10118-021-2636-6

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