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Laser beam scanning system for irradiation in an external quadrangular form for soldering of quad flat package IC

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Abstract

We propose a new soldering process and a system for a quad flat package IC (QFP-IC). The incident line-formed laser beam converted by this system can realize an external quadrangular form line for the non-contact regional heating, to provide thin and light weight electronic packages as required. The laser beam pumped by an yttrium aluminum garnet (YAG) laser oscillator is split into four beams. Using a galvano motor, which can scan the reflection mirror with high frequencies, the laser beam can change the heating line. The soldering time for QFP-IC of 100 pins with the 0.65 mm pitch was 6 s. As the regional heating just only junctions, the temperature in the resin package was lower than 141 °C after solder fusion. From the experimental result, it is confirmed that this method is less damage to a resin package than a conventional whole heating method.

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Acknowledgments

This work was supported by Toshiba Corporate Manufacturing Center.

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Authors and Affiliations

  1. Postgraduate Course of Functional Control System, Shibaura Institute of Technology, 3-7-5 Toyosu, Koto-ku, Tokyo, 135-8548, Japan

    Hitoshi Tsuchiya & Tetsuya Homma

  2. Corporate Manufacturing Engineering Center, Toshiba Corporation, 33 Shin-isogo-cho, Isogo-ku, Yokohama, Kanagawa, 235-0017, Japan

    Hitoshi Tsuchiya

Authors
  1. Hitoshi Tsuchiya
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  2. Tetsuya Homma
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Correspondence to Hitoshi Tsuchiya.

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Tsuchiya, H., Homma, T. Laser beam scanning system for irradiation in an external quadrangular form for soldering of quad flat package IC. Opt Rev 22, 1–8 (2015). https://doi.org/10.1007/s10043-015-0032-6

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  • DOI: https://doi.org/10.1007/s10043-015-0032-6

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