Abstract
A deep-ultraviolet (UV) microscope can output critical dimension (CD) that is consistent with an aerial image on a wafer even if the cross-sectional profile of the pattern on a photomask is varied. According to theoretical calculation, CD measured by the deep-UV microscope depends on global transmissivity, and so does the aerial image on a wafer if the cross-sectional profile is varied. The results of simulation and experiment indicate that offset between CD measured by deep-UV microscope and CD determined by the aerial image is constant despite variation of the cross-sectional profile.
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References
Max Born and Emil Wolf: Principles of Optics, (Pergamon Press, Oxford, 1964) 2nd ed., Chap. 8.6.3, p. 418.
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Yamane, T., Hirano, T. Photomask Critical Dimension Metrology with Deep-Ultraviolet Microscope. OPT REV 10, 375–381 (2003). https://doi.org/10.1007/s10043-003-0375-2
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DOI: https://doi.org/10.1007/s10043-003-0375-2