Enhanced dielectric properties of modified Ta₂O₅ thin films

Abstract

 Tantalum oxide (Ta₂O₅) is a promising high dielectric constant material for the DRAM applications because of its ease of integration compared to other complex oxide dielectrics. The dielectric constant and thermal stability characteristics of bulk Ta₂O₅ samples were reported to enhance significantly through small substitutions of Al₂O₃. However, this improvement in the dielectric constant of (1-x)Ta₂O₅-xAl₂O₃ is not clearly understood. The present research attempts to explain the higher dielectric constant of (1-x)Ta₂O₅-xAl₂O₃ by fabricating thin films with enhanced dielectric properties. A higher dielectric constant of 42.8 was obtained for 0.9Ta₂O₅–0.1Al₂O₃ thin films compared to that reported for pure Ta₂O₅ (25–30). This increase was shown to be closely related to a-axis orientation. Pure Ta₂O₅ thin films with similar a-axis orientation also exhibited a high dielectric constant of 51.7, thus confirming the orientation effect. The leakage current properties and the reliability characteristics were also found to be improved with Al₂O₃ addition.