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Growth and field crystallization of anodic films on Ta–Nb alloys

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Abstract

The growth behavior of amorphous anodic films on Ta–Nb solid solution alloys has been investigated over a wide composition range at a constant current density of 50 A m−2 in 0.1 mol dm−3 ammonium pentaborate electrolyte. The anodic films consist of two layers, comprising a thin outer Nb2O5 layer and an inner layer consisting of units of Ta2O5 and Nb2O5. The outer Nb2O5 layer is formed as a consequence of the faster outward migration of Nb5+ ions, compared with Ta5+ ions, during film growth under the high electric field. Their relative migration rates are independent of the alloy composition. The formation ratio, density, and capacitance of the films show a linear relation to the alloy composition. The susceptibility of the anodic films to field crystallization during anodizing at constant voltage increases with increasing niobium content of the alloy.

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Authors and Affiliations

  1. Division of Materials Chemistry, Faculty of Engineering, Hokkaido University, Sapporo, Hokkaido, 060-8628, Japan

    S. Komiyama, E. Tsuji, Y. Aoki & H. Habazaki

  2. Dipartimento di Ingegneria Chimica dei Processi e dei Materiali, Università degli Studi di Palermo, Viale delle Scienze, 90128, Palermo, Italy

    M. Santamaria & F. Di Quarto

  3. Corrosion and Protection Centre, School of Materials, The University of Manchester, Manchester, M13 9PL, UK

    P. Skeldon & G. E. Thompson

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  1. S. Komiyama
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  2. E. Tsuji
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  4. H. Habazaki
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Correspondence to H. Habazaki.

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Komiyama, S., Tsuji, E., Aoki, Y. et al. Growth and field crystallization of anodic films on Ta–Nb alloys. J Solid State Electrochem 16, 1595–1604 (2012). https://doi.org/10.1007/s10008-011-1565-7

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  • DOI: https://doi.org/10.1007/s10008-011-1565-7

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