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Improving the adhesion of polymethacrylate thin films onto indium tin oxide electrodes using a silane-based “Molecular Adhesive”

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Abstract

Indium tin oxide (ITO) is the most commonly used transparent conducting substance. It has been used in numerous applications such as light-emitting diodes. In most applications and studies, the ITO surface is further coated with additional layers. The interface between the ITO and the coating is of utmost importance since it affects the physical and chemical properties of the final device. Improving the adhesion between ITO and a coating layer can be achieved by applying a “molecular adhesive” as an inter-phasing molecular layer. In this study, we used 3-(trimethoxysilyl)propyl methacrylate as a “molecule adhesive” for better connection between ITO and a polymethacrylate layer. The samples were studied by electrochemistry, contact angle goniometry, atomic force microscopy, and nano scratch microscopy. These studies clearly show that a simple silanization process formed a thin molecular adhesive layer, which did not influence the physical and chemical properties of the final coated electrode and at the same time increased significantly the adhesion between the ITO and the polymethacrylate coating.

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Acknowledgment

This project was partially supported by the Binational Science Foundation (2008039). The center of nanocharacterization of the Hebrew University is acknowledged.

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Authors and Affiliations

  1. Institute of Chemistry, The Hebrew University of Jerusalem, Jerusalem, 91904, Israel

    Roni Ginzburg-Turgeman & Daniel Mandler

  2. CSM Instruments SA, Peseux, Switzerland

    Jean-Baptiste Guion

Authors
  1. Roni Ginzburg-Turgeman
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  2. Jean-Baptiste Guion
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  3. Daniel Mandler
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Correspondence to Daniel Mandler.

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Ginzburg-Turgeman, R., Guion, JB. & Mandler, D. Improving the adhesion of polymethacrylate thin films onto indium tin oxide electrodes using a silane-based “Molecular Adhesive”. J Solid State Electrochem 15, 2401–2407 (2011). https://doi.org/10.1007/s10008-011-1454-0

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  • DOI: https://doi.org/10.1007/s10008-011-1454-0

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