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Intermetallic phase formation in electrochemical alloy deposition

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Abstract

Three examples of the electrochemical deposition of intermetallic phases are shown. Electrodeposition of the single-phase β′-brass superlattice at underpotentials of Zn in Cu-Zn alloy plating is explained by an accumulative underpotential deposition (UPD) mechanism. Growth of the Cu-Sn intermetallic phase layer in the contact immersion deposition of Sn onto Cu is accounted for by a UPD/vertical solid-state diffusion mechanism. Ag3Sn formation in the Sn/Ag-nanoparticle composite plating is illustrated by atomic site exchange at the interface between the deposited Sn matrix and the occluded Ag nanoparticles.

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Authors and Affiliations

  1. Osaka Municipal Technical Research Institute, 1-6-50 Morinomiya, Joto-ku, 536-8553, Osaka , Japan

    Yutaka Fujiwara & Hidehiko Enomoto

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  1. Yutaka Fujiwara
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  2. Hidehiko Enomoto
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Correspondence to Yutaka Fujiwara.

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Fujiwara, Y., Enomoto, H. Intermetallic phase formation in electrochemical alloy deposition. J Solid State Electrochem 8, 167–173 (2004). https://doi.org/10.1007/s10008-003-0441-5

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  • DOI: https://doi.org/10.1007/s10008-003-0441-5

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