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Thermal stress at a circular hole in cubic crystals under uniform heat flow

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Abstract

Thermal stress at a circular hole in cubic crystals subjected to uniform heat flow is investigated. The influence of the medium inside the hole is taken into account; thermal conductivity and internal pressure inside the hole are specifically considered. Two different anisotropic responses in cubic crystals have been found, and their behaviors can be correlated with Zener’s anisotropy factor of the material. Several cubic crystals including niobium, molybdenum, silicon, nickel, and copper are used to illustrate this finding.

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  1. Department of Power Mechanical Engineering, National Tsing Hua University, Hsin Chu, 30013, Taiwan

    Chun-Ron Chiang

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  1. Chun-Ron Chiang
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Correspondence to Chun-Ron Chiang.

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Chiang, CR. Thermal stress at a circular hole in cubic crystals under uniform heat flow. Acta Mech 229, 3963–3969 (2018). https://doi.org/10.1007/s00707-018-2205-4

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  • DOI: https://doi.org/10.1007/s00707-018-2205-4

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