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Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer

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Abstract

This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The cracks are assumed to be thermally insulated disturbing a steady-state uniform heat flow, and the solution is obtained within the framework of linear plane thermoelasticity. The Fourier integral transform method is employed, and the formulation of the current nonisothermal crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stress fields in the bonded system. In the numerical results, parametric studies are conducted so that the variations in mixed-mode thermal stress intensity factors are presented as a function of offset crack distance for various geometric and material combinations of the dissimilar homogeneous media bonded through the thermoelastically graded interlayer, elaborating thermally induced singular interaction of the two neighboring interfacial cracks.

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  1. School of Mechanical Systems Engineering, Kookmin University, Seoul, 136-702, Republic of Korea

    Hyung Jip Choi

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Choi, H.J. Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer. Acta Mech 225, 2111–2131 (2014). https://doi.org/10.1007/s00707-013-1080-2

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  • DOI: https://doi.org/10.1007/s00707-013-1080-2

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