Abstract.
This article presents investigations regarding the incorporation of organic impurities in thin electroplated Cu metallizations. RF-GD-OES (radio frequency glow discharge optical emission spectrometry) was used for detection of C and H as indicators for incorporated hydrocarbon molecules. The presented results indicate a fragmentation of incorporated hydrocarbons and their constrict segregation near the Cu surface. The bilateral relationship between incorporated organic impurities and intrinsic stress behavior is associated with the Gorky effect.
Similar content being viewed by others
References
K Wetzig C M Schneider (2003) Metal based thin films for electronics Wiley-VCH Weinheim
P C Andricacos C Uzoh J O Dukovic J Horkans H Deligianni (1998) Electrochim Microfab 42 567 Occurrence Handle1:CAS:528:DyaK1cXmt1Kjsbc%3D
M Stangl J Acker A Henssge W Gruner V Hoffmann H Wendrock K Wetzig (2005) Galvanotechnik 96 1084 Occurrence Handle1:CAS:528:DC%2BD2MXmsVGrsrw%3D
M Kang A A Gewirth (2003) J Electrochem Soc 150 C426 Occurrence Handle1:CAS:528:DC%2BD3sXlsVOht74%3D Occurrence Handle10.1149/1.1572152
J M E Harper C Cabral P C Andricacos L Gignac I C Noyan K P Rodbell (1999) J Appl Phys 86 2516 Occurrence Handle1:CAS:528:DyaK1MXltFGksL8%3D Occurrence Handle10.1063/1.371086
M S Yoon Y J Park Y C Joo (2002) Thin Solid Films 408 230 Occurrence Handle1:CAS:528:DC%2BD38Xjt1Kitb4%3D Occurrence Handle10.1016/S0040-6090(02)00126-8
Brunoldi G, Guerrieri S, Alberici S, Ravizza E, Tallarida G, Wiemer C, Marangon T (2005) Copper self-annealing effect and its impact on ECD copper physical properties. Materials for Advanced Metallization (MAM) Conference-Proceeding 125
Brongersma S H, Kerr E, Vervoort I, Maex K (2002) Grain structure evolution during annealing of electroplated copper. Sixth International Workshop on Stress-Induced Phenomena in Metallization (2001, Ithaca, New York). AIP Conference Proceedings 612: 229
S Lagrange S H Brongersma M Judelewicz A Saerens I Vervoort E Richard R Palmans K Maex (2000) Microelectr Eng 50 449 Occurrence Handle1:CAS:528:DC%2BD3cXhtValsg%3D%3D Occurrence Handle10.1016/S0167-9317(99)00314-7
C Lingk M E Gross (1998) J Appl Phys 84 5547 Occurrence Handle1:CAS:528:DyaK1cXmvFyhtL4%3D Occurrence Handle10.1063/1.368856
W H Teh L T Koh S M Chen J XIE C Y Li P D Foo (2001) Microelectr J 32 579 Occurrence Handle1:CAS:528:DC%2BD3MXktV2gsL4%3D Occurrence Handle10.1016/S0026-2692(01)00035-0
V A Vas’ko I Tabakovic S C Riemer M T Kief (2004) Microelectr Eng 75 71 Occurrence Handle1:CAS:528:DC%2BD2cXkvVCqs7g%3D Occurrence Handle10.1016/j.mee.2003.10.008
M Stangl J Acker V Dittel W Gruner V Hoffmann K Wetzig (2005) Microelectr Eng 82 182
M Stangl V Dittel J Acker V Hoffmann W Gruner S Strehle K Wetzig (2005) Appl Surf Sci 252 158 Occurrence Handle1:CAS:528:DC%2BD2MXpvVyhtL8%3D Occurrence Handle10.1016/j.apsusc.2005.02.006
M Militzer P Freundlich D Bizzotto (2004) Mat Sci Forum 467–470 1339 Occurrence Handle10.4028/www.scientific.net/MSF.467-470.1339
T P Moffat D Wheeler D Jossell (2004) J Electrochem Soc 151 C262 Occurrence Handle1:CAS:528:DC%2BD2cXitFSksr4%3D Occurrence Handle10.1149/1.1651530
S Miura H Honma (2003) Surf Coat Techn 169–170 91 Occurrence Handle10.1016/S0257-8972(03)00165-8 Occurrence Handle1:CAS:528:DC%2BD3sXjvFWktL4%3D
H Bakker H Mehrer (1990) Diffusion in solid metals and alloys Springer Berlin Heidelberg
S H Brongersma E Kerr I Vervoort A Saerens K Maex (2002) J Mater Res 17 582 Occurrence Handle1:CAS:528:DC%2BD38XjtFWksr0%3D
A H Verbruggen C W Hagen R Griessen (1984) J Phys F: Met Phys 14 1431 Occurrence Handle1:CAS:528:DyaL2cXkvFyjsbY%3D Occurrence Handle10.1088/0305-4608/14/6/011
R Koch (1994) J Phys: Condens Matter 6 9519 Occurrence Handle1:CAS:528:DyaK2MXitV2gs78%3D Occurrence Handle10.1088/0953-8984/6/45/005
W S Zhang Z L Zhang X W Zhang (2002) J Alloys Comp 336 170 Occurrence Handle1:CAS:528:DC%2BD38XhvVWlur8%3D Occurrence Handle10.1016/S0925-8388(01)01852-7
C V Thompson (1990) Annu Rev Mater Sci 20 245 Occurrence Handle1:CAS:528:DyaK3MXnt1Chug%3D%3D Occurrence Handle10.1146/annurev.ms.20.080190.001333
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Stangl, M., Acker, J., Hoffmann, V. et al. Segregation of organic impurities in thin electroplated Cu metallizations. Microchim Acta 156, 159–162 (2006). https://doi.org/10.1007/s00604-006-0606-x
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00604-006-0606-x