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Lithography-induced hydrophobic surfaces of silicon wafers with excellent anisotropic wetting properties

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Abstract

In recent years, hydrophobic surfaces have attracted more and more attentions from many researchers. In this paper, we comprehensively discussed the effects of specific parameters of microstructures on the wetting properties by using the theoretical models, the effects of microstructures on two-dimensional anisotropic properties and the water droplet impact experiment. Firstly, the relationships between the CAs and variable parameters were explored after the formula derivation for three various patterns. Then three different patterns were fabricated successfully on the silicon wafers by lithography technology and the effects of microstructures (including LWD parameters and interval parameters) on surface wettability were studied based on the theoretical research. After that, the effects of microstructures on two-dimensional anisotropic properties were also studied. Finally, the water droplet impact experiment was carried out and the viscoelastic properties were simply investigated. Our research proposed a potential method for fabricating hydrophobic surfaces with excellent anisotropic properties. This method may be widely used in a variety of academic and industrial applications in the future.

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Acknowledgements

This work was supported by China-EU H2020 International Science and Technology Cooperation Project (FabSurfWAR Nos. 2016YFE0112100 and 644971) and National Natural Science Foundations of China [Nos. 51405333, 51675371, 51675376 and 51675367]. The authors are particularly grateful to Tianjin University and Xian Jiaotong University for the technical support. Jiajing Zhu wish to gratefully acknowledge the financial support by China Scholarship Council.

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Zhu, J., Tian, Y., Liu, X. et al. Lithography-induced hydrophobic surfaces of silicon wafers with excellent anisotropic wetting properties. Microsyst Technol 25, 735–745 (2019). https://doi.org/10.1007/s00542-018-4010-3

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