Microsystem Technologies

, Volume 24, Issue 5, pp 2169–2175 | Cite as

Design, simulation and fabrication of LTCC-based microhotplate for gas sensor applications

Technical Paper
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Abstract

This paper presents the design, simulation and fabrication of LTCC-based isothermally interconnected microhotplate. A thermal electric finite element analysis is used to examine the electro-thermo-mechanical behaviour of microhotplate. The heating element is platinum having resistivity 100 mΩ/sq and LTCC is the base substrate. The simulation has been performed for different thicknesses of LTCC substrate. The fabrication has been carried out for 0.711 mm thick LTCC substrate. The comparison between simulation results and characteristics of fabricated microhotplate on 0.711 mm thick LTCC substrate has been made. The variation in temperature of simulated and fabricated microhotplates has been analyzed with respect to the applied voltages.

Notes

Acknowledgements

The authors are thankful to Dr. Nikhil Suri, Mr. D. Kharbanda, Mr. Achu Chandran, Mr. Sunil Kumar, Mr. I. C. Sharma, Mr. Bhawani Shankar, Mr. Ankit Paptan and other members of Advanced Packaging Group, CSIR-CEERI Pilani. The authors are also thankful to Mr. Ashok Chauhan and Mr. Bhupendra Kushwaha of ODG, CSIR-CEERI Pilani. The authors are grateful to Dr. Kanad Ray AMITY University Rajasthan for his kind support. The authors express their sincere thanks to Director CSIR-CEERI Pilani.

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Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2018

Authors and Affiliations

  1. 1.Advanced Packaging GroupCSIR-Central Electronics Engineering Research InstitutePilaniIndia
  2. 2.Amity UniversityJaipurIndia

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