Wafer-level vacuum package of two-dimensional micro-scanner
We present wafer-level vacuum package of two-dimensional (2-D) micro-scanner based on glass-silicon anodic bonding. To form the sacrificial gap for evacuating air in the package cavity before hermetically sealed, the reflow process of Au/Sn/Cr posts due to low-melting temperature of Sn metal is introduced. Structures in Pyrex glass wafers are patterned using wet etching in the 49% HF solution. The 2-D micro-scanner is fabricated by the SOI-based micromachining technology. The resonant frequencies of 2-D micro-scanner after packaged in vacuum are 30 kHz and 290 Hz for the inner mirror and the gimbal frame respectively. The rotation angle of packaged 2-D micro-scanner is 25° at driving voltages of 20 and 17 V for the inner mirror and the gimbal frame respectively. The pressure in the package is estimated in terms of measuring the quality factor of packaged 2-D micro-scanner. The effect of packaging on the performance of the 2-D micro-scanner such as squeeze film air damping caused by the optical window and the substrate is also analyzed in this paper.
The devices were fabricated in Micro/Nano-Machining Research and Education Center, Tohoku University. This work is supported by the Japanese Society for the Promotion of Science (JSPS) (Grant no. K122-2134).
- Tachibana H, Kawano K, Ueda H, Noge H (2009) Vacuum wafer level packaged two-dimensional optical scanner by anodic bonding. In: Proceedings of the MEMS, pp 959–962Google Scholar
- Tanaka S, Honjoya Y, Esashi M (2010) AuSn solder vacuum packaging using melted solder floodgates and laser-activated non-evaporable getters for SiC diaphragm anticorrosive vacuum sensors. In: Proceedings of the MEMS, pp 492–495Google Scholar