Microsystem Technologies

, Volume 24, Issue 5, pp 2159–2168 | Cite as

Wafer-level vacuum package of two-dimensional micro-scanner

Technical Paper
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Abstract

We present wafer-level vacuum package of two-dimensional (2-D) micro-scanner based on glass-silicon anodic bonding. To form the sacrificial gap for evacuating air in the package cavity before hermetically sealed, the reflow process of Au/Sn/Cr posts due to low-melting temperature of Sn metal is introduced. Structures in Pyrex glass wafers are patterned using wet etching in the 49% HF solution. The 2-D micro-scanner is fabricated by the SOI-based micromachining technology. The resonant frequencies of 2-D micro-scanner after packaged in vacuum are 30 kHz and 290 Hz for the inner mirror and the gimbal frame respectively. The rotation angle of packaged 2-D micro-scanner is 25° at driving voltages of 20 and 17 V for the inner mirror and the gimbal frame respectively. The pressure in the package is estimated in terms of measuring the quality factor of packaged 2-D micro-scanner. The effect of packaging on the performance of the 2-D micro-scanner such as squeeze film air damping caused by the optical window and the substrate is also analyzed in this paper.

Notes

Acknowledgements

The devices were fabricated in Micro/Nano-Machining Research and Education Center, Tohoku University. This work is supported by the Japanese Society for the Promotion of Science (JSPS) (Grant no. K122-2134).

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Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2017

Authors and Affiliations

  1. 1.Department of NanomechanicsTohoku UniversitySendaiJapan
  2. 2.International Training Institute for Materials ScienceHanoi University of Science and TechnologyHanoiVietnam

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