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Design and fabrication of micro-LED array with application-specific integrated circuits (ASICs) light emitting display

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Abstract

An optimized array process of micro light-emitting diode (LED) display is descripted as follows. Silicon nitride (SiNx) is the main component of dielectric protective layer as a mask layer in the fine-grain etching process of LED pixel platform. GaN-based material is etched by the etching mask layer. The size of 12 × 12 μm micro-die LED array is used as the test pattern, and an approximate thickness of SiNx film is 2.63 μm during LED epitaxial growth. An etch mask of SiNx dielectric protection layer and the inductively coupled plasma etching equipment are utilized for etching the pattern and transferring to GaN LED epitaxial film. The etch depth is about 6.4 μm, and the final pattern size is about 11.06 μm. The ultimate etched sidewall angle of micro-grain GaN LED is close to vertical. During the dip-coating process, the etching shift on top of the fine crystal GaN LED platform becomes narrower because of the larger size of the dielectric protection layer. The metal contact electrodes are fabricated on micro LED die platform. The results of this research are valuable for driving the micro-LED display with application-specific integrated circuits (ASICs) system. The shift register, the counter, and the decoder module are combined in ASIC system as a novel technique. Three-dimensional multi-data processing chip can control the drive of 128 × 40 matrix and a total of 5120 LED number, and driving the entire panel takes only 20.5 ms.

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References

  • Ayub S, Gossler C, Schwaerzle M, Klein E, Paul O, Schwarz UT, Ruther P (2016) High-density probe with integrated thin-film micro light emitting diodes (μLEDs) for optogenetic applications. In: 2016 IEEE 29th international conference on micro electro mechanical systems (MEMS), pp 379–382

  • Cha W-J, Cho Y-W, Kwon J-M, Kwon B-H (2014) Single power-conversion LED backlight driving system with high power factor control. J Disp Technol 10(5):407–413

    Article  Google Scholar 

  • Chen M-T, Lin S-H, Chou D-Y, Chen J-J (2016) Study of driving source efficiency improvement for high power LED street lighting system using Taguchi method. In: 2016 IEEE international conference on industrial technology (ICIT), pp 372–377

  • Choi HW, Jeon CW, Dawson MD, Edwards PR, Martin RW (2003) Fabrication and performance of parallel-addressed InGaN micro-LED arrays. IEEE Photon Technol Lett 15(4):510–512

    Article  Google Scholar 

  • Guilhabert B, Massoubre D, Richardson E, McKendry JJD, Valentine G, Henderson RK, Watson IM, Gu E, Dawson MD (2012) Sub-micron lithography using InGaN micro-LEDs: mask-free fabrication of LED arrays. IEEE Photon Technol Lett 24(24):2221–2224

    Article  Google Scholar 

  • Huang S-J, Lee T-S, Lin P-Y (2014) Application of piezoelectric-transformer-based resonant circuits for AC LED lighting-driven systems with frequency-tracking techniques. IEEE Trans Ind Electron 61(12):6700–6709

    Article  Google Scholar 

  • Jeon CW, Choi HW, Dawson MD (2003) Fabrication and performance of high-density, matrix-addressable green and ultraviolet micro-LED arrays, LEOS 2003. In: The 16th annual meeting of the IEEE Lasers and Electro-Optics Society, vol 2, pp 878–879

  • Lee S-Y, Kim H-S, Kwon J-W, Lee C-H, Choi M-S, Oh B-W (2007) New design of integrated power and integrated driver with LED module (IP-IDLM) driving system for LED backlight in LCD. In: IEEE international symposium on industrial electronics, pp 584–587

  • Ling L, Zhong S, Han Z, Yang N, Sun T, Lin P (2015) A double closed-loop control system for driving high brightness LED applied in spectral measurements. In: IEEE advanced information technology, electronic and automation control conference (IAEAC), pp 672–675

  • Liu ZJ, Wong KM, Keung CW, Tang CW, Lau KM (2009) Monolithic LED microdisplay on active matrix substrate using flip-chip technology. IEEE J Sel Top Quantum Electron 15(4):1298–1302

    Article  Google Scholar 

  • Lv X, Loo KH, Lai YM, Tse CK (2013) Energy efficient LED driving system for large-scale video display panel. In: IECON 2013—39th annual conference of the IEEE Industrial Electronics Society, pp 6063–6068

  • Nam K-S, Kwon O-K (2012) A highly power-efficient LED backlight driving system for LCD TVs. IEEE Trans Consum Electron 58(2):264–268

    Article  Google Scholar 

  • Peng D, Zhang K, Chao VS-D, Mo W, Lau KM, Liu Z (2016) Full-color pixelated-addressable light emitting diode on transparent substrate (LEDoTS) micro-displays by CoB. J Disp Technol 12(7):742–746

    Article  Google Scholar 

  • Shi B, Zhou B, Wei J, Qin X, Yang Y, Liu B (2016) A novel LED drive system based on matrix rectifier. In: 2016 IEEE applied power electronics conference and exposition (APEC), pp 843–847

  • Wang T, Fu X, Ma J, Zhan T, Wang Q, Yi X, Wang G, Li J, Wang T (2015) Analysis of impedance matching network on LED novel driving system based on the wireless power transfer. In: 2015 12th China international forum on solid state lighting (SSLCHINA), pp 93–96

  • Xu K, Zhang Z, Yu Q, Wen Z (2016) Field-effect electroluminescence spectra of reverse-biased PN junctions in silicon device for microdisplay. J Disp Technol 12(2):115–121

    Google Scholar 

  • Zhan T, Ma J, Yi X, Koh SW, Wang J, Wu X, Wang G, Li J (2014)Wireless-driven LED semiconductor lighting system. In: 2014 11th China international forum on solid state lighting (SSLCHINA), pp 71–75

  • Zhou Z, Wan X, Shi Y, Wang Z, Zhang B (2012) High-precision LED driving system based on LLC resonant converter. In: IET International conference on information science and control engineering 2012 (ICISCE 2012), pp 1–5

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Acknowledgements

This work was supported by Industrial Technology Research Institute Electronics and Opto-Electronics Research Laboratories, Ming-Hsien Wu, Yi-Chen Lin, Chia-Hsin Chao, and Yen-Hsiang Fang. And the authors acknowledge of MOST 105-2221-E-151-065-.

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Authors and Affiliations

  1. School of Biomedical Engineering, Taipei Medical University, Taipei, 11031, Taiwan

    Jian-Chiun Liou

  2. Department of Chemical and Materials Engineering, National University of Kaohsiung, Kaohsiung, 811, Taiwan

    Cheng-Fu Yang

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  1. Jian-Chiun Liou
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  2. Cheng-Fu Yang
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Contributions

J-CL conceived, designed fabricated the experiments of the ASIC system and wrote the paper.

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Correspondence to Jian-Chiun Liou.

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The authors declare no conflict of interest.

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Liou, JC., Yang, CF. Design and fabrication of micro-LED array with application-specific integrated circuits (ASICs) light emitting display. Microsyst Technol 24, 4089–4099 (2018). https://doi.org/10.1007/s00542-017-3640-1

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  • DOI: https://doi.org/10.1007/s00542-017-3640-1

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