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Electrodeposition of Si–DLC nanocomposite film and its electronic application

Abstract

In this study, a silicon doped diamond-like carbon (DLC) nanocomposite film was deposited electrochemically and it was used to fabricate an Ag/Si–DLC/p-Si metal–interlayer–semiconductor (MIS) Schottky diode. Methanol (CH3OH) was used as carbon and tetraethoxysilane (Si(OC2H5)4) as Si source, respectively. Morphology of the film was observed by scanning electron microscopy and continuous surface with numerous lumps spread randomly was observed. Structural and chemical composition analyses of the film were carried out by Raman and X-ray photoelectron spectroscopy. Typical D and G bands of DLC films were not observed in the Raman spectrum due to abundance of Si–C bonds. Silicon incorporation promoted the film deposition and increased sp3 bonds in the film. Current–Voltage (IV) measurement was conducted to obtain parameters of the MIS diode. The diode exhibited a good rectifier behavior with ~ 103 rectification ratio. In the forward bias semi-logarithmic IV plot, two linear regions with different slopes were observed. Such behavior was modelled by two parallel diodes and attributed to different conduction mechanism. The main electrical parameters, such as barrier height, ideality factor and series resistance were calculated by IV and Cheung–Cheung methods. The Si–DLC nanocomposite film acted as barrier height modifier in the MIS diode.

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Acknowledgements

This work was supported by the Scientific Research Project Committee of Gaziosmanpasa University (under the Grand contract no: 2015/88).

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Correspondence to Necati Basman.

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Basman, N., Uzun, R., Gocer, E. et al. Electrodeposition of Si–DLC nanocomposite film and its electronic application. Microsyst Technol 24, 2287–2294 (2018). https://doi.org/10.1007/s00542-017-3635-y

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  • DOI: https://doi.org/10.1007/s00542-017-3635-y