Microsystem Technologies

, Volume 24, Issue 5, pp 2473–2483 | Cite as

Study on the fabrication of a SU-8 cantilever vertically-allocated in a closed fluidic microchannel

  • Zebing Mao
  • Kazuhiro Yoshida
  • Joon-wan Kim
Technical Paper


This paper describes the fabrication of a vertically-allocated SU-8 cantilever in a closed fluidic channel. The difficulties to fabricate the vertically-allocated SU-8 cantilever inside the closed channel mainly lie in which kinds of sacrificial layers under the cantilever and sealing methods for enclosing the channel are utilized for the movability of the cantilever. To obtain a suitable sacrificial layer and high sealing quality, the selectivity of sacrificial layers and the sealing conditions based on the SU-8 adhesive are discussed in this paper. The experiments to test different photoresist lead to the conclusion that AZ 5214E is adequate for the sacrificial layer. Also, the bonding results indicate that the thickness of the uncrosslinked SU-8 solid layer is the most important factor which affects the formation of a proper gap between the top coverglass and the SU-8 cantilever. The photos of the movement of the cantilever also show that the free-standing SU-8 cantilever is successfully fabricated by releasing the suitable sacrificial layer and is allocated inside the closed channel by the method of SU-8 adhesive. The fabrication method in this paper is also useful for other microfluidic applications.


  1. Abgrall P, Lattes C, Dollat X (2005) A novel fabrication method of flexible and monolithic 3D microfluidic structures using lamination of SU-8 films. J Micromech Microeng 16:113CrossRefGoogle Scholar
  2. Agirregabiria M, Blanco F, Berganzo J, Arroyo M, Fullaondo A, Mayora K, Ruano-Lopez J (2005) Fabrication of SU-8 multilayer microstructures based on successive CMOS compatible adhesive bonding and releasing steps. Lab Chip 5:545–552CrossRefGoogle Scholar
  3. Amirouche F, Zhou Y, Johnson T (2009) Current micropump technologies and their biomedical applications. Microsyst Technol 15:647–666CrossRefGoogle Scholar
  4. Blanco F et al (2004) Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding. J Micromech Microeng 14:1047CrossRefGoogle Scholar
  5. Bouwstra S, Legtenberg R, Tilmans HA, Elwenspoek M (1990) Resonating microbridge mass flow sensor. Sensors Actuators A Phys 21:332–335CrossRefGoogle Scholar
  6. Calleja M, Rasmussen PA, Johansson A, Boisen A (2003) Polymeric mechanical sensors with piezoresistive readout integrated in a microfluidic system. In: Smart sensors, actuators, and MEMS. International society for optics and photonics, pp 314–322Google Scholar
  7. Cheng C-H, Tseng Y-P (2013) Characteristic studies of the piezoelectrically actuated micropump with check valve. Microsyst Technol 19:1707–1715CrossRefGoogle Scholar
  8. Chuang Y-J, Tseng F-G, Cheng J-H, Lin W-K (2003) A novel fabrication method of embedded micro-channels by using SU-8 thick-film photoresists. Sensors Actuators A Phys 103:64–69CrossRefGoogle Scholar
  9. Dy AJ, Cosmanescu A, Sluka J, Glazier JA, Stupack D, Amarie D (2014) Fabricating microfluidic valve master molds in SU-8 photoresist. J Micromech Microeng 24:057001CrossRefGoogle Scholar
  10. Ezkerra A, Fernandez L, Mayora K, Ruano-Lopez J (2007) Fabrication of SU-8 free-standing structures embedded in microchannels for microfluidic control. J Micromech Microeng 17:2264CrossRefGoogle Scholar
  11. Helbo B, Kristensen A, Menon A (2003) A micro-cavity fluidic dye laser. J Micromech Microeng 13:307CrossRefGoogle Scholar
  12. Kim J-W, Nguyen TV, Edamura K, Yokota S (2016) Triangular prism and slit electrode pair for ECF jetting fabricated by thick micromold and electroforming as micro hydraulic pressure source for soft microrobots. Int J Autom Technol 10:470–478CrossRefGoogle Scholar
  13. Li L, Xiao Z, Tan S, Pu L, Zhang Z (2004) Composite PDMS membrane with high flux for the separation of organics from water by pervaporation. J Membr Sci 243:177–187CrossRefGoogle Scholar
  14. Lin C-H, Lee G-B, Chang B-W, Chang G-L (2002) A new fabrication process for ultra-thick microfluidic microstructures utilizing SU-8 photoresist. J Micromech Microeng 12:590CrossRefGoogle Scholar
  15. Lorenz H, Despont M, Fahrni N, LaBianca N, Renaud P, Vettiger P (1997) SU-8: a low-cost negative resist for MEMS. J Micromech Microeng 7:121CrossRefGoogle Scholar
  16. Luo C, Govindaraju A, Garra J, Schneider T, White R, Currie J, Paranjape M (2004) Releasing SU-8 structures using polystyrene as a sacrificial material. Sensors Actuators A Phys 114:123–128CrossRefGoogle Scholar
  17. Mao Z, Zhao J, Xuan W, Wang W, Luo J, Xie J (2017) Distilling determination of water content in hydraulic oil with a ZnO/glass surface acoustic wave device. Microsyst Technol 23:1841–1845CrossRefGoogle Scholar
  18. Maszara W, Goetz G, Caviglia A, McKitterick J (1988) Bonding of silicon wafers for silicon-on-insulator. J Appl Phys 64:4943–4950CrossRefGoogle Scholar
  19. Nguyen N (1997) Micromachined flow sensors—a review. Flow Meas Instrum 8:7–16CrossRefGoogle Scholar
  20. Nguyen N-T, Truong T-Q (2004) A fully polymeric micropump with piezoelectric actuator. Sensors Actuators B Chem 97:137–143CrossRefGoogle Scholar
  21. Ni J, Wang B, Chang S, Lin Q (2014) An integrated planar magnetic micropump. Microelectron Eng 117:35–40CrossRefGoogle Scholar
  22. Pan C, Yang H, Shen S, Chou M, Chou H (2002) A low-temperature wafer bonding technique using patternable materials. J Micromech Microeng 12:611CrossRefGoogle Scholar
  23. Piotter V, Bauer W, Benzler T, Emde A (2001) Injection molding of components for microsystems. Microsyst Technol 7:99–102CrossRefGoogle Scholar
  24. Rahbar M, Shannon L, Gray BL (2016) Design, fabrication and characterization of an arrayable all-polymer microfluidic valve employing highly magnetic rare-earth composite polymer. J Micromech Microeng 26:055012CrossRefGoogle Scholar
  25. Vilkner T, Janasek D, Manz A (2004) Micro total analysis systems. Recent developments. Anal Chem 76:3373–3386CrossRefGoogle Scholar

Copyright information

© Springer-Verlag GmbH Germany 2017

Authors and Affiliations

  1. 1.Department of Mechanical Engineering, School of EngineeringTokyo Institute of TechnologyYokohamaJapan
  2. 2.Institute of Innovative Research (IIR)Tokyo Institute of TechnologyYokohamaJapan

Personalised recommendations