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A thermodynamic study of voiding phenomena in Cu–Cu thermo-compression wafer bonding

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Abstract

The influence of wafer bonding and post-bond annealing conditions on the (cavity) void size and distribution was investigated theoretically and verified experimentally. Based on Cu–Cu thermo-compression bonding at 175 °C for 30 min and subsequent annealing at 200 °C for 1, 6 and 24 h, respectively, in both cases the total void surface reduces with the duration of the heat treatment, showing good correlation between theory and experiment. However, the experimental results revealed that the average void size increases while voids number decreases, which is a deviation from the prediction of the physical model.

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Authors and Affiliations

  1. EV Group, DI E. Thallner Straße 1, 4782, St. Florian/Inn, Austria

    B. Rebhan

  2. Institute of Physics of Materials, Academy of Sciences of the Czech Republic, 616 62, Brno, Czech Republic

    J. Svoboda

  3. Center of Surface and Nanoanalytics, Johannes Kepler University, 4040, Linz, Austria

    M. Panholzer

Authors
  1. B. Rebhan
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  2. J. Svoboda
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  3. M. Panholzer
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Correspondence to B. Rebhan.

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Rebhan, B., Svoboda, J. & Panholzer, M. A thermodynamic study of voiding phenomena in Cu–Cu thermo-compression wafer bonding. Microsyst Technol 24, 815–822 (2018). https://doi.org/10.1007/s00542-017-3523-5

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  • DOI: https://doi.org/10.1007/s00542-017-3523-5

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