Microsystem Technologies

, Volume 22, Issue 3, pp 495–501

Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress

  • A. Lucibello
  • G. Capoccia
  • E. Proietti
  • R. Marcelli
  • B. Margesin
  • V. Mulloni
  • F. Giacomozzi
  • F. Vitulli
  • M. Scipioni
  • G. Bartolucci
Technical Paper

DOI: 10.1007/s00542-015-2577-5

Cite this article as:
Lucibello, A., Capoccia, G., Proietti, E. et al. Microsyst Technol (2016) 22: 495. doi:10.1007/s00542-015-2577-5

Abstract

Space components need a ground characterization based on several solicitations, including mechanical and thermal stress, before their final qualification. In this paper, RF MEMS switches designed for redundancy logic have been extensively measured with promising results in terms of thermal and mechanical cycles. Packaging contributions have also been discussed.

Copyright information

© Springer-Verlag Berlin Heidelberg 2015

Authors and Affiliations

  • A. Lucibello
    • 1
  • G. Capoccia
    • 1
  • E. Proietti
    • 1
  • R. Marcelli
    • 1
  • B. Margesin
    • 2
  • V. Mulloni
    • 2
  • F. Giacomozzi
    • 2
  • F. Vitulli
    • 3
  • M. Scipioni
    • 3
  • G. Bartolucci
    • 1
    • 4
  1. 1.Institute for Microelectronics and MicrosystemsCNR-IMM RomaRomeItaly
  2. 2.MEMS Research UnitFondazione Bruno KesslerPovoItaly
  3. 3.Thales Alenia SpaceRomeItaly
  4. 4.Department of Electronic EngineeringUniversity of Roma “Tor Vergata”RomeItaly

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