Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress
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- Lucibello, A., Capoccia, G., Proietti, E. et al. Microsyst Technol (2016) 22: 495. doi:10.1007/s00542-015-2577-5
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Space components need a ground characterization based on several solicitations, including mechanical and thermal stress, before their final qualification. In this paper, RF MEMS switches designed for redundancy logic have been extensively measured with promising results in terms of thermal and mechanical cycles. Packaging contributions have also been discussed.