Microsystem Technologies

, Volume 21, Issue 3, pp 669–674 | Cite as

Oxidized bridges technology for suspended MEMS fabrication using standard silicon wafer

Technical Paper

Abstract

This paper presents a new method for electrically isolating released single crystal silicon MEMS structures. The technology employees double-side processing deep reactive ion etching to obtain functional high aspect ratio micromechanical structures and deep silicon oxidizing to isolate them from bulk silicon. Applicability of the technology to MEMS design was demonstrated with fabrication of the monolithic integrated bulk micromachined comb drive.

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Copyright information

© Springer-Verlag Berlin Heidelberg 2014

Authors and Affiliations

  1. 1.Physics-Technology Institute Yaroslavl BranchRussian Academy of SciencesYaroslavl’Russia

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