Abstract
For the development of a small and low-cost microbolometer, wafer-level reliability characterization techniques for vacuum-level packaged wafers are introduced. Amorphous-silicon-based microbolometer-type vacuum sensors fabricated on an 8-inch wafer are bonded with a cap wafer by using an Au–Sn eutectic solder. Membrane deflection and integrated vacuum sensor techniques are independently used to characterize the hermeticity at the wafer level. For a packaged wafer with a membrane thickness below 100 μm, it is possible to determine the hermeticity via a screening test performed using an optical detector. An integrated vacuum sensor having the same structure as a bolometer pixel shows a vacuum level below 100 mTorr. All steps from the packaging process to the fine hermeticity test are implemented at the wafer level to verify that high-volume and low-cost production of the microbolometer is possible.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
Alex Dommann, Antonia Neelsa et al (2011) Reliability in hermetic MEMS wafer level packaging. EPoSS Ann Forum. http://www.smart-systems-integration.org/public/documents/presentations/presentations-annual-Forum-2011/eposs-annualforum-2011-6-october-2011/session-3-smart-systems-andmanufacturing/3_Session3_Dommann_CSEM_Reliability%20in%20Hermetic%20MEMS%20Wafer%20Level%20Packaging.pdf
S Garcia-Blanco, P Topart, Y Desroches, JS Caron et al (2008) Low-temperature vacuum hermetic wafer-level package for uncooled microbolometer FPAs. In: Proceedings of SPIE 6884
Jérémie Dhennin (2011) Advanced techniques for NDT of MEMSdevices and WL packaging. Challenges for 3D systems Workshop
Jin-Shown Shie, Bruce CS Chou, Yeong-Maw Chen (1995) High performance Pirani vacuum gauge. J Vac Sci Technol A 13(6):2972–2975
Kim HY et al (2011) Mechanical Robustness of FPA in a-Si microbolometer with fine pitch. Sensors Transducers J 11:56–63
Michael Shillinger (2011) Bonding reliability testing for wafer level packaged MEMS devices, MEMS J. http://www.memsjournal.com/2011/10/bonding-reliability-testing-for-wafer-level-packaged-mems-devices.html
Schomburg WK (2011) Introduction to microsystem design. Springer, Berlin
Tissot JL (2004) IR detection with uncooled focal plane arrays. State of the art and trends. Opto-Electron Rev 12(1):105–109
TH Kim, KM Kyung et al (2012) Development of microbolometer with high fill factor and high mechanical stability by shared-anchor structure. In: Proceedings SPIE 8353
Yole Report (2011) Uncooled IR cameras and detectors for thermography and vision report
Acknowledgments
This work was supported by the Metropolitan Economies Collaboration Program (R0000694) and the Daedeok Technology Business Program (Announcement 2011-343) funded by MKE (Ministry of Knowledge Economy). This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science and Technology (grant number: 2012R1A1A2007707).
Author information
Authors and Affiliations
Corresponding authors
Rights and permissions
About this article
Cite this article
Yang, C.M., Jung, H., Park, J.H. et al. Wafer-level reliability characterization for wafer-level-packaged microbolometer with ultrasmall array size. Microsyst Technol 20, 889–897 (2014). https://doi.org/10.1007/s00542-014-2072-4
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00542-014-2072-4