Skip to main content
SpringerLink
Log in

Flexible integration of MEMS and IC for low-cost production of wireless sensor nodes

  • Technical Paper
  • Published:
Microsystem Technologies Aims and scope Submit manuscript

Abstract

In this paper, we proposed a flexible process for size-free MEMS and IC integration with high efficiency for MEMS ubiquitous applications in wireless sensor network. In this approach, MEMS and IC can be fabricated individually by different wafers. MEMS and IC known-good-dies (KGD) are temporarily bonded onto carrier wafer with rapid and high-accurate self-alignment by using fine pattern of hydrophobic surface assembled monolayer and capillary force of H2O; and then KGD are de-bonded from carrier wafer and transferred to target wafer by wafer level permanent bonding with plasma surface activation to reduce bonding temperature and load force. By applying above 2-step process, size of both wafer and chip could be flexible selected. Besides, CMOS processed wafer or silicon interposer can be used as the target wafer. This approach offers us excellent process flexibilities for low-cost production of wireless sensor nodes.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10

Similar content being viewed by others

References

  • Akyildiz IF, Su W, Sankarasubramaniam Y, Cayirci E (2002) Wireless sensor networks: a survey. Comput Net 38:393–422. doi:10.1016/S1389-1286(01)00302-4

    Article  Google Scholar 

  • Fukushima T, Iwata E, Ohara Y, Noriki A, Inamura K, Lee K.W, Bea J, Tanaka T, Koyanagi M (2009) Three-dimensional integration technology based on reconfigured wafer-to-wafer and multichip-to-wafer stacking using self-assembly method. In: Proceedings of the IEEE-IEDM09, Baltimore, USA, Dec. 7–9, 2009, pp 349–352. doi:10.1109/IEDM.2009.5424353

  • Higurashi E, Imamura T, Suga T, Sawada R (2007) Low temperature bonding of laser diode chips on silicon substrates using plasma activation of Au films. IEEE Photon Technol Lett 19:1994–1996. doi:10.1109/LPT.2007.908642

    Article  Google Scholar 

  • Itoh T, Zhang Y, Matsumoto M, Maeda R (2009) Wireless sensor network for power consumption reduction in information and communication systems, In: Proceedings of 8th IEEE Conference on Sensors, Christchurch, NZ, Oct. 25–28, 2009, pp 572–575. doi:10.1109/ICSENS.2009.5398308

  • Kangwook L, Fukushima T, Tanaka T, Koyanagi M (2010) 3D hybrid integration technology for opto-electronic hetero-integrated systems. ECS Trans 33:71–90. doi:10.1149/1.3501035

    Google Scholar 

  • Kobrin B, Zhang T, Grimes MT, Chong K, Wanebo M, Chinn J, Nowak R (2006) An improved chemical resistance and mecahnical durability of hydrophobic FDTS coating. J Phys Conf Series (Int MEMS Conf 2006) 34:454–547. doi:10.1088/1742-6596/34/1/074

    Article  Google Scholar 

  • Kushmerick JG, Hankins MG, Boer MP, de Clews PJ, Carpick RW, Bunker BC (2001) The influence of coating structure on micromachine stiction. Tribol Lett 10:103–108. doi:10.1023/A:1009082530479

    Article  Google Scholar 

  • Lapisa M, Stemme G, Niklaus F (2011) Wafer level heterogeneous integration for MOEMS MEMS, and NEMS. IEEE J Sel Top Quant Electron 17:629–644. doi:10.1109/JSTQE.2010.2093570

    Article  Google Scholar 

  • Lu J, Nakano Y, Takagi H, Maeda R (2012) Chip to wafer temporary bonding with self-alignment by patterned FDTS layer for size-free MEMS integration, IEEE Sens J (in press)

  • Oliveira LM, Rodrigues JJ (2011) Wireless sensor networks: a survey on environmental monitoring. J Commun 6:143–151. doi:10.4304/jcm.6.2.143-151

    Google Scholar 

  • Sheng KCW, Premachandran CS, Kyond CW, Ong L, Ratmin A, Myo P, Lau J (2008) C2W bonding method for MEMS applications. In: Proceedings of the 10th Electronics Packaging Technology Conference (EPTC2008), Singapore, Dec. 9–12, 2008, pp 1283–1287. doi:10.1109/EPTC.2008.4763607

  • Srinivasam U, Liepmann D, Howe RT (2001) Microstructure to substrate self-assembly using capillary forces. J Microelectromech Sys 10:17–24. doi:10.1109/84.911087

    Article  Google Scholar 

  • Topol AW, Furman BK, Guarini KW, Shi L, Cohen GM, Walker GF (2004) Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures. In: Proceedings of the 54th Electronic Components and Technology Conference (ECTC2004), Las Vegas, USA, June 1–4, 2004, pp 931–938. doi:10.1109/ECTC.2004.1319449

  • Witvrouw A (2006) CMOS-MEMS integration: why, how and what? In: Proceedings of the IEEE/ACM International Conference on Computer-aided Design 2006, San Jose, USA, Nov. 5–9, 2006, pp 826–827. doi:10.1109/ICCAD.2006.320128

  • Witvrouw A (2008) CMOS–MEMS integration today and tomorrow. Scripta Mater 59:945–949. doi:10.1016/j.scriptamat.2008.06.043

    Article  Google Scholar 

  • Yick J, Mukherjee B, Ghosal D (2008) Wireless sensor network survey. Comput Netw 52:2292–2330. doi:10.1016/j.comnet.2008.04.002

    Article  Google Scholar 

Download references

Acknowledgments

This work is granted by the Japan Society for the Promotion of Science (JSPS) through the “Funding Program for World-Leading Innovative R&D on Science and Technology (FIRST Program),” initiated by the Council for Science and Technology Policy (CSTP).

Author information

Authors and Affiliations

  1. Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of Advanced Industrial Science and Technology (AIST), Namiki 1-2-1, Tsukuba, Ibaraki, Japan

    Jian Lu, Hideki Takagi, Yuta Nakano & Ryutaro Maeda

  2. Tokyo University of Science, Tokyo, Japan

    Yuta Nakano

Authors
  1. Jian Lu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Hideki Takagi
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Yuta Nakano
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Ryutaro Maeda
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jian Lu.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Lu, J., Takagi, H., Nakano, Y. et al. Flexible integration of MEMS and IC for low-cost production of wireless sensor nodes. Microsyst Technol 19, 775–781 (2013). https://doi.org/10.1007/s00542-013-1752-9

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00542-013-1752-9

Keywords

Search

Navigation