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Hot embossing of thermoplastic multilayered stacks

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Abstract

The combination of different polymer materials during replication offers additional opportunities for fabrication and functionality of microsystems. Different surface and structural properties of polymers allow for improvements in microsystems for example by means of hydrophilic and hydrophobic combinations in microfluidic devices. Due to its high flexibility and precision hot embossing as one of the established micro replication processes facilitates processing of several polymer layers in one single process step. By this multi-component process micro structured systems consisting of thin layers of different polymers with adapted surface properties are fabricated. In this paper we describe the challenge of molding different types of polymers and some applications for multi-component micro systems.

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References

  • Eckardt H (1987) Co-injection charting new territory and opening new markets. J Cell Plast 23:555–592

    Article  Google Scholar 

  • Fischer JM (2003) Handbook of molded part shrinkage and warpage. William Andrew, Norwich

    Google Scholar 

  • Koltay P, Steger R, Bohl B, Zengerle R (2004) The dispensing well plate: a novel nanodispenser for the multiparallel delivery of liquids. Sens Actuators A 116:483–491

    Article  Google Scholar 

  • Menges G, Michaeli W, Mohren P (1999) How to make injection molds. Hanser, Munich

    Google Scholar 

  • Worgull M (2009) Hot embossing—theory and technology of microreplication. William Andrew, Burlington

    Google Scholar 

  • Zoetelief WF, Peters GWM, Meijer HEH (1997) Numerical simulation of the multi-component injection molding process. Int Polym Process 3:216–227

    Google Scholar 

Download references

Acknowledgments

The authors acknowledge the partially funding for the presented work by the European Commission within the framework of the FP7 research projects COTECH “Converging technologies for micro systems manufacturing” (CP-IP 214491-2 COTECH) and MULTILAYER (FP7-NMP4-2007-214122) and the support by the European infrastructure project EUMINAfab.

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Authors and Affiliations

  1. School of Engineering, Cardiff University, The Parade, Cardiff, CF24 3AA, Wales, UK

    A. Kolew

  2. Karlsruhe Institute of Technology, Institute of Microstructure Technology, 76128, Karlsruhe, Germany

    A. Kolew, M. Heilig, M. Schneider, K. Sikora, D. Münch & M. Worgull

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  1. A. Kolew
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  2. M. Heilig
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  3. M. Schneider
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  4. K. Sikora
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  5. D. Münch
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  6. M. Worgull
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Correspondence to A. Kolew.

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Kolew, A., Heilig, M., Schneider, M. et al. Hot embossing of thermoplastic multilayered stacks. Microsyst Technol 18, 1857–1861 (2012). https://doi.org/10.1007/s00542-012-1502-4

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  • DOI: https://doi.org/10.1007/s00542-012-1502-4

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