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Thickness measurement in ultrathick multilayer microstructures

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Abstract

Microparts are more and more mass products and quality assurance becomes an important factor in manufacturing. Based on a new optical principle, a tool was developed and tested which is well suited for easy non-destructive measurements at microstructures as well as for measurement at transparent layers. Thickness measurement of ca. 1 mm ultrathick photoresist layers on non-patterned high-reflective gold surface was demonstrated. As well, measurement of multi layer systems consisting of each several hundred micrometers thick transparent layers was verified at capped microfluidic channel structures.

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Correspondence to Rainer Engelke.

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Engelke, R., Richter, U. Thickness measurement in ultrathick multilayer microstructures. Microsyst Technol 16, 1513–1516 (2010). https://doi.org/10.1007/s00542-010-1064-2

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  • DOI: https://doi.org/10.1007/s00542-010-1064-2

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