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Flip chip packaging for MEMS microphones

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Abstract

We have developed a microphone package using flip chip technology instead of chip and wire bonding to create smaller MEMS microphones. With this new packaging technology the transducer chip and an ASIC chip are flip chip bonded on a ceramic substrate. The package is sealed by a polymer foil laminated over the chips and by a metal layer. The sound port is on the bottom side in the ceramic substrate. In this paper the packaging technology is explained in detail and results of electro-acoustic characterization and reliability testing are presented. We will also explain the way which has led us from the packaging of Surface Acoustic Wave (SAW) components to the packaging of MEMS microphones.

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Authors and Affiliations

  1. University of Applied Sciences – München, Munich, Germany

    Gregor Feiertag

  2. EPCOS AG, Anzinger Str. 13, 81671, Munich, Germany

    Matthias Winter & Anton Leidl

  3. Saarland University, Saarbrücken, Germany

    Matthias Winter

Authors
  1. Gregor Feiertag
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  2. Matthias Winter
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  3. Anton Leidl
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Corresponding author

Correspondence to Gregor Feiertag.

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Feiertag, G., Winter, M. & Leidl, A. Flip chip packaging for MEMS microphones. Microsyst Technol 16, 817–823 (2010). https://doi.org/10.1007/s00542-010-1039-3

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  • DOI: https://doi.org/10.1007/s00542-010-1039-3

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