Abstract
In this paper, the combination of UV-LIGA with the Micro electro-discharge machining (Micro-EDM) process was investigated to fabricate high-aspect-ratio electrode array, and an easy and rapid process for fabricating ultra-thick SU-8 microstructures up to millimeter depth was described. First, the modified UV-LIGA process was used to fabricate the copper hole array, and then the hole array electrode was employed as a tool in the Micro-EDM process to fabricate the multiple-tipped electrodes. Electrode array of various shapes have been fabricated by this technique. The aspect ratio is up to 17.65.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
Becnel C, Desta Y, Kelly K (2005) Ultra-deep x-ray lithography of densely packed SU-8 features: I: an SU-8 casting procedure to obtain uniform solvent content with accompanying experimental results. J Micromech Microeng 15:1242–1248. doi:10.1088/0960-1317/15/6/015
Bogdanov AL, Peredkov SS (2000) Use of SU-8 PR for very high aspect x-ray lithography. Microelectron Eng 53:493–496. doi:10.1016/S0167-9317(00)00363-4
Bystrova S, Luttge R, van den Berg A (2007) Study of crack formation in high-aspect-ratio SU-8 structures on silicon. Microelectron Eng 84:1113–1116. doi:10.1016/j.mee.2007.01.091
Fofonoff TA, Martel SM, Hatsopoulos NG et al (2004) Microelectrode array fabrication by electrical discharge machining and chemical etching. IEEE Trans Biomed Eng 51(6):890–895. doi:10.1109/TBME.2004.826679
Ho CB-H, Chin K-P, Yang C-R et al (2002) Ultrathick SU-8 mold formation and removal, and its application to the fabrication of LIGA-like micromotors with embedded roots. Sens Actuators A 102:130–138. doi:10.1016/S0924-4247(02)00297-2
Lorenz H, Despont M, LaBianca N (1997) SU-8: a low-cost negative resist for MEMS. J Micromech Microeng 7:121–124. doi:10.1088/0960-1317/7/3/010
Lorenz H, Despont M, Fahrni M et al (1998) High-aspect-ratio, ultrathick, negative-tone near-UV PR and its applications for MEMS. Sens Actuators A 64:33–39. doi:10.1016/S0924-4247(98)80055-1
Masaki T, Kawata K, Masuzawa T (1990) Micro electro-discharge machining and its applications. Proc. IEEE MEMS:21–26
Takahata K, Gianchandani YB (2002) Batch mode micro-electro-discharge machining. Microelectromech Syst 11:102–110. doi:10.1109/84.993444
Williams JBD, Wang W (2004) Study on the postbaking process and the effects on UV lithography of high aspect ratio SU-8 microstructures. J Microlith Microfab Microsyst 3(4):563–568. doi:10.1117/1.1792650
Zhang J, Tan KL, Hong GD et al (2001) Polymerization optimization of SU-8 PR and its applications in microfluidic systems and MEMS. J Micromech Microeng 11:20–26. doi:10.1088/0960-1317/11/1/304
Acknowledgment
The authors would like to thank the Nature Science Foundation of China for supporting this study under contract (NSFC 50635040).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Hu, YY., Zhu, D., Qu, N.S. et al. Fabrication of high-aspect-ratio electrode array by combining UV-LIGA with micro electro-discharge machining. Microsyst Technol 15, 519–525 (2009). https://doi.org/10.1007/s00542-008-0745-6
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00542-008-0745-6