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Manufacturing process for high aspect ratio metallic micro parts made by electroplating on partially conductive templates

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References

  • Finnah G, Naumann K, Holstein N, Piotter V, Ruprecht R, Hausselt J (2004) Herstellung von metallischen Mikrokomponenten durch Einlegespritzgießen und anschließende Galvanoformung. Galvanotechnik 95:S2776–S2780

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  • Piotter V, Holstein N, Ruprecht R, Schanz G (2003a) Electroforming of metallic microparts via two-component injection molding of sacrificial templates MICRO SYSTEM technologies 2003. In: International conference and exhibition on micro electro, opto, mechanical systems and components, München

  • Piotter V, Holstein N, Oskotski E, Schanz G, Ruprecht R, Hausselt J (2003b) Metal micro parts made by electroforming on two-component lost polymer moulds. In: Proceedings of 3rd Euspen international conference, Eindhoven, pp 367–370

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Acknowledgments

This project is supported by the German Research Foundation (DFG) within the Research Group 702 “Machine, tool and process development of new methods to produce micro parts by liquid phases”. The subproject 5 is called “Two-component micro injection moulding of different conductive polymers for direct deposition out of liquid electrolyte.” We also thank all involved colleagues of IMF III and the members of the research group for their assistance.

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Author notes

  1. G. Finnah

    Present address: Robert Bosch GmbH, Postfach 1127, 71301, Waiblingen, Germany

Authors and Affiliations

  1. Forschungszentrum Karlsruhe, IMF III, Postfach 3640, 76021, Karlsruhe, Germany

    J. Prokop, G. Finnah, J. Lorenz, V. Piotter, R. Ruprecht & J. Hausselt

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  1. J. Prokop
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  2. G. Finnah
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  3. J. Lorenz
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  4. V. Piotter
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  5. R. Ruprecht
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  6. J. Hausselt
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Correspondence to J. Prokop.

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Prokop, J., Finnah, G., Lorenz, J. et al. Manufacturing process for high aspect ratio metallic micro parts made by electroplating on partially conductive templates. Microsyst Technol 14, 1669–1674 (2008). https://doi.org/10.1007/s00542-008-0570-y

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  • DOI: https://doi.org/10.1007/s00542-008-0570-y

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