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Stress engineering and mechanical properties of SU-8-layers for mechanical applications

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Abstract

SU-8 is an essential material for manufacturing micromechanical components with high demands in aspect ratio and toughness in the area of micro-system technologies. For reproducible production of SU-8 components, e.g. polymeric AFM-cantilevers and chip carriers, a characterization sequence for the material in its raw state and in all subsequent processing steps was developed. Included in these tests were differential scanning calorimetry of the unprocessed resist, in situ monitoring of the solid content during soft bake, measurement of the stress behaviour during and after post-exposure bake as well as determination of micro-hardness and Young’s modulus at different baking and exposure conditions. The results are promising with respect to definition of a novel procedure for reproducible preparation of micromechanical components from SU-8.

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Acknowledgments

The authors would like to thank all participants and contributors to this work, especially to co-workers from Westsaechsische Hochschule Zwickau. Special thanks goes to Juergen Vogel and his crew (WHZ) doing tension–expansion-measurements, to BESSY (Berlin) for the helpful discussions and particularly to Hella Scheer (University Wuppertal) for technical assistance during preparation of this paper. This work was partly supported by BMBF and SAB/Dresden.

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Authors and Affiliations

  1. Westsaechsische Hochschule Zwickau, University of Applied Sciences, MEMS-Group, Dr.-Friedrichs-Ring 2a, 08056, Zwickau, Germany

    J. Hammacher, A. Fuelle, J. Flaemig, J. Saupe & J. Grimm

  2. BESSY GmbH, Albert-Einstein-Strasse 15, 12489, Berlin, Germany

    B. Loechel

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  1. J. Hammacher
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  2. A. Fuelle
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  3. J. Flaemig
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  4. J. Saupe
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  5. B. Loechel
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  6. J. Grimm
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Correspondence to J. Grimm.

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Hammacher, J., Fuelle, A., Flaemig, J. et al. Stress engineering and mechanical properties of SU-8-layers for mechanical applications. Microsyst Technol 14, 1515–1523 (2008). https://doi.org/10.1007/s00542-007-0534-7

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  • DOI: https://doi.org/10.1007/s00542-007-0534-7

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