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Microscale molding replication of Cu- and Ni-based structures

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Abstract

Microdevices and microsystems made of metals can possess unique functionalities. Metal-based high-aspect-ratio microscale structures (HARMS) are basic building blocks of such microdevices and microsystems. Cost-effective fabrication of metal-based HARMS is paramount to the economic viability of such devices and systems. Microscale molding replication promises low-cost, high-throughput production of metal-based HARMS. In this paper, results on molding replication of Cu- and Ni-based HARMS are reported. Molding response of Cu was measured as a function of temperature. Attempts were made to rationalize measured molding responses with companion high-temperature tensile testing. Fabrication of Ni-based HARMS by compression molding is demonstrated successfully for the first time.

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Acknowledgments

We gratefully acknowledge partial project support from NSF through grants DMI-0400061/DMI-0556100, and from the Louisiana Board of Regents (LA BoR) through contract LEQSF (2004-07)-RD-B-06.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Louisiana State University, Baton Rouge, LA, 70803, USA

    J. Jiang, Fanghua Mei & W. J. Meng

  2. High Temperature Materials Laboratory, Oak Ridge National Laboratory, Oak Ridge, TN, 37831, USA

    E. Lara-Curzio

Authors
  1. J. Jiang
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  2. Fanghua Mei
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  3. W. J. Meng
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  4. E. Lara-Curzio
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Corresponding author

Correspondence to W. J. Meng.

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Jiang, J., Mei, F., Meng, W.J. et al. Microscale molding replication of Cu- and Ni-based structures. Microsyst Technol 14, 1731–1737 (2008). https://doi.org/10.1007/s00542-007-0516-9

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  • DOI: https://doi.org/10.1007/s00542-007-0516-9

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