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Germanium resistors for RF MEMS based microsystems

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Abstract

This paper introduces the use of germanium as resistive material in RF MicroElectroMechanical (MEMS) devices. Integrated resistors are indeed highly required into RF MEMS components, in order to prevent any RF signal leakage in the bias lines and also to be compatible with ICs. Germanium material presents strong advantages compared to others. It is widely used in microtechnologies, notably as an important semi-conductor in SiGe transistors as well as sacrificial or structural layers and also mask layer in various processes (Si micromachining especially). But it also presents a very high resistivity value. This property is particularly interesting in the elaboration of integrated resistors for RF components, as it assures miniaturized resistors in total agreement with electromagnetic requirements. Its compatibility as resistive material in MEMS has been carried out. Its integration in an entire MEMS process has been fruitfully achieved and led to the successful demonstration and validation of integrated Ge resistors into serial RF MEMS variable capacitors or switches, without any RF perturbations.

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References

  • Bordas C, Grenier K, Dubuc D, Paillard M, Cazaux J-L, Plana R (2006) Performances optimization of capacitive parallel MEMS switches, Yokohama, Japan, December 12–15 APMC’06

  • Colace L, Masini G, Assanto G (1999) Ge on Si approaches to the detection of near-infrared light. IEEE J Quantum Electron 35:1843–1852

    Article  Google Scholar 

  • Franke A, Heck J, King T, Howe R (2003) Polycrystalline silicon-germanium films for integrated microsystems. J MEMS 12:160–171

    Google Scholar 

  • Grenier K, Dubuc D, Mazenq L, Busquère J-P, Ducarouge B, Bouchriha F, Rennane A, Lubecke V, Pons P, Ancey P, Plana R (2004) Polymer based technologies for microwave and millimeterwave applications. In: 50th IEEE IEDM’04, San Francisco, USA, December 13–15

  • Grenier K, Bordas C, Pinaud S, Salvagnac L, Dubuc D (2007) Germanium as an integrated resistor material in RF MEMS switches. In: SPIE microtechnologies for the new millenium 2007, Maspalomas, Spain, May 2–4, Conference 6589

  • Hara M, Kuypers J, Abe T, Esahi M (2003) MEMS based thin film 2 GHz resonator for CMOS integration. IEEE MTT-S Int, Philadelphia, USA, June 8–13, 3:1797–1800

  • Hayden J, Rebeiz G (2003) Very low-loss distributed X-band and Ka-band MEMS phase shifters using metal-air-metal capacitors. IEEE MTT 51:309–314

    Article  Google Scholar 

  • Kola R, Lau M, Duenas S, Kumagai H, Smith P, Frye R, Tai K, Sullivan P (1997) Thin film resistors and capacitors for advanced packaging. Int Symp Ad Pack Materials 71–74

  • Lakshminarayanan B, Weller T (2006) Design and modeling of 4-bit slow-wave MEMS phase shifters. IEEE MTT 54:120–127

    Article  Google Scholar 

  • Leinenbach C, Seidel H, Fuchs T, Kronmueller S, Laermer F (2007) A novel sacrificial layer technology based on highly selective etching of silicon-germanium in CLF3. IEEE MEMS 2007 conference, Kobe, Japan, January 21–25, 65–68

  • Li B, Xiong B, Jiang L, Zohar Y, Wong M (1999) Germanium as a versatile material for low-temperature micromachining. J MEMS 8:366–372

    Google Scholar 

  • Mahfoz-Kotb H, Salaün AC, Mohammed-Brahim T, Coulon N, Bonnaud O (2004) Air-gap polysilicon thin film transistors on glass substrates. Sens Actuators A 113:344–349

    Article  Google Scholar 

  • Oh J, Campbell JC, Thomas G, Bharatan S, Thoma R, Jasper C, Jones R, Zirkle T (2002) Interdigitated Ge p-i-n photodetectors fabricated on a Si substrate using graded SiGe buffer layers. IEEE J Quantum Electron 38:1238–1241

    Article  Google Scholar 

  • Russer P (1998) Si and SiGe millimeter-wave integrated circuits. IEEE MTT 46:590–603

    Article  Google Scholar 

  • Schmidtchen J, Schüppert B, Splett A, Petermann K (1992) Germanium-diffused wavguide in silicon for λ = 1.3 μm and λ = 1.55 μm with losses below 0.5 dB/cm. IEEE Photonics Technol Lett 4:1843–1852

    Article  Google Scholar 

  • Shen H, Arreaga J, Ramanathan R, Knoedler H, Sawyer J, Tiku S (2003) Fabrication and characterization of thin film resistors for GaAs-baed power amplifiers. Int conf on comp semicond manuf tech, CS ManTech’03

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Grenier, K., Bordas, C., Pinaud, S. et al. Germanium resistors for RF MEMS based microsystems. Microsyst Technol 14, 601–606 (2008). https://doi.org/10.1007/s00542-007-0448-4

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  • DOI: https://doi.org/10.1007/s00542-007-0448-4

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