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Evaluation of eutectic bond strength and assembly of Al-based microfluidic structures

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Abstract

Metal-based microscale heat exchangers have potential advantages over similar Si-based devices. Bonding and assembly are critical for building functional metal-based microfluidic devices from metallic high-aspect-ratio microscale structures (HARMS). In this paper, we report eutectic bonding of Al specimens with Al–Ge thin film intermediate layers. Quantitative evaluation of bond strengths was carried out as a function of various bonding parameters, including bonding temperature, applied pressure, and Al–Ge intermediate layer thickness. With this eutectic bonding strategy, successful assembly of multilayered Al microfluidic structures is demonstrated.

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References

  • Tuckerman DB, Pease RFW (1981) High performance heat sinking for VLSI. IEEE Elect Dev Lett 2(5):126

    Google Scholar 

  • Madou M (2000) Fundamentals of microfabrication. CRC Press, Boca Raton

    Google Scholar 

  • Mudawar I (2001) Assessment of high heat flux thermal management schemes. IEEE Trans Compon Pack Technol 24:122

    Article  Google Scholar 

  • Kohl MJ, Abdel-Khalik SI, Jeter SM, Sadowski DL (2005) An experimental investigation of microchannel flow with internal pressure measurements. Int J Heat Mass Transf 48:1518

    Article  Google Scholar 

  • Lee PS, Garimella SV, Liu D (2005) Investigation of heat transfer in rectangular microchannels. Int J Heat Mass Transf 48:1688

    Article  Google Scholar 

  • Becker EW, Ehrfeld W, Munchmeyer D, Betz H, Heuberger A, Pongratz S, Glashauser W, Michel HJ, Siemens VR (1982) Production of separation-nozzle systems for uranium enrichment by a combination of X-ray-lithography and galvanoplastics. Naturwissenschaften 69:520

    Article  Google Scholar 

  • Harris C, Despa M, Kelly KW (2000) Design and fabrication of a cross flow micro heat exchanger. J MEMS 9:502

    Google Scholar 

  • Arias F, Oliver SRJ, Xu B, Homlin RE, Whitesides GM (2001) Fabrication of metallic heat exchangers using sacrificial polymer mandrils. J MEMS 10:107

    Google Scholar 

  • Cao DM, Meng WJ (2004) Microscale compression molding of Al with surface engineered LiGA inserts. Microsyst Technol 10:662–670

    Article  Google Scholar 

  • Cao DM, Jiang J, Meng WJ, Jiang JC, Wang W (2007) Fabrication of high-aspect-ratio microscale Ta mold inserts with micro-electrical-discharge-machining. Microsyst Technol 13:503–510

    Article  Google Scholar 

  • Cao DM, Wang T, Feng B, Meng WJ, Kelly KW (2001) Amorphous hydrocarbon based thin films for high-aspect-ratio MEMS applications. Thin Solid Films 398/399:553

    Article  Google Scholar 

  • Cao DM, Meng WJ, Simko SJ, Doll GL, Wang T, Kelly KW (2003) Conformal deposition of Ti-containing hydrocarbon coatings over LiGA fabricated high-aspect-ratio micro-scale structures and tribological characteristics. Thin Solid Films 429:46

    Article  Google Scholar 

  • Cao DM, Jiang J, Yang R, Meng WJ (2006) Fabrication of high-aspect-ratio microscale mold inserts by parallel μEDM. Microsyst Technol 12:839

    Google Scholar 

  • Nese M, Hanneborg A (1993) Anodic bonding of silicon to silicon-wafers coated with aluminum, silicon-oxide, polysilicon, or silicon-nitride. Sensor Actuat A 37(8):61–67

    Article  Google Scholar 

  • Harendt C, Hofflinger B, Graf HG et al (1991) Silicon direct bonding for sensor applications—characterization of the bond quality. Sensor Actuat A 25:87–92

    Article  Google Scholar 

  • Hunt CE, Desmond CA, Ciarlo DR, Benett WJ (1991) Direct bonding of micromachined silicon wafers for laser diode heat exchanger applications. J Micromech Microeng 1(3):152–156

    Article  Google Scholar 

  • Hanneborg A, Nese M, Ohlckers P (1991) Silicon-to-silicon anodic bonding with a borosilicate glass layer. J Micromech Microeng 1(3):139–144

    Article  Google Scholar 

  • Mei F, Jiang J, Meng WJ (2007) Eutectic bonding of Al-based high aspect ratio microscale structures. Microsyst Technol 13:723–730

    Article  Google Scholar 

  • Meng WJ, Curtis TJ (1997) Inductively coupled plasma assisted physical vapor deposition of titanium nitride coatings. J Electron Mater 26:1297

    Article  Google Scholar 

  • Meng WJ, Curtis TJ, Rehn LE, Baldo PM (1999) Temperature dependence of inductively coupled plasma assisted deposition of titanium nitride coatings. Surf Coat Technol 120/121:206

    Article  Google Scholar 

  • Massalski TB (ed) (1986) Binary alloy phase diagrams. ASM, Metals Park, p 116

  • Hertzberg RW (1996) Deformation and fracture mechanics of engineering materials. Wiley, New York

    Google Scholar 

  • Jiang J, Meng WJ, Sinclair GB, Lara-Curzio E (2007) Further experiments and modeling for microscale compression molding of metals at elevated temperatures. J Mater Res (in press)

Download references

Acknowledgments

We gratefully acknowledge partial project support from NSF through grants DMI-0400061 and DMI-0556100, and from Louisiana State Board of Regents through contract LEQSF(2004-07)-RD-B-06. Technical assistance by Mr. D. V. Muthyala, Mr. M. Alam, Prof. G. Li, and Prof. D. Nikitopoulos is acknowledged with thanks.

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Authors and Affiliations

  1. Mechanical Engineering Department, Louisiana State University, 2508 CEBA Building, Baton Rouge, LA, 70803, USA

    Fanghua Mei, J. Jiang & W. J. Meng

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  1. Fanghua Mei
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  2. J. Jiang
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  3. W. J. Meng
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Correspondence to W. J. Meng.

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Mei, F., Jiang, J. & Meng, W.J. Evaluation of eutectic bond strength and assembly of Al-based microfluidic structures. Microsyst Technol 14, 99–107 (2008). https://doi.org/10.1007/s00542-007-0407-0

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  • DOI: https://doi.org/10.1007/s00542-007-0407-0

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