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A novel packaging approach for RF MEMS switching functions on alumina substrate

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Abstract

This paper reports the design of a hermetic-compatible wafer-scale package for RF MEMS based components. The presented packaging concept consists in encapsulating the whole RF device or subsystem instead of encapsulating each MEMS component separately, which will reduce the device size and cost. This approach is based on the MEMS fabrication technology on ceramic substrate and the use of laser drilled vias hole techniques to realize full metallized vias in alumina substrates. These vias holes will allow a low loss RF signal transmission inside the package without breaking its hermeticity. Hence, several packaged switching networks prototypes, based on ohmic contact MEMS switches, have been designed following this approach and the packaging electromagnetic impact on these components has been especially studied to result on good performance devices.

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References

  • Lee J, Je CH, Kang S, Member, Choi C. A. (2005) A low-loss single-pole six-throw switch based on compact RF MEMS switches. IEEE Trans Microwave Theory Tech 53(11):3335–3344

  • Margomenos A, Katehi LPB (2004) Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS. IEEE Trans Microwave Theory Tech 52:56

    Google Scholar 

  • Min BW, Rebeiz GM (2006) A low-loss silicon-on-silicon DC–110-GHz resonance-free package. IEEE Trans Microwave Theory Tech 54:52

    Google Scholar 

  • Min BW, Entesari K, Rebeiz GM (2004) DC-50 GHz low-loss wafer-scale package for RF MEMS. In: European microwave week symposium, Amsterdam

  • Pothier A et al (2005) MEMS DC contact micro relays on ceramic substrate for space communication switching network. In: Thirty-fifth European microwave week conference dig (EuMW), Paris, October 2005

  • Rebeiz GM (2003) RF MEMS theory, design, and technology. Wiley, London

  • Varadan VK, Vinoy KJ, Jose KA (2003) RF MEMS and their applications. Wiley, London

  • Woode RA, Ivanov EN, Tobar ME, Blair DG (1994) Measurement of dielectric loss tangent of alumina at microwave frequencies and room temperature. Electron Lett 30:25

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Authors and Affiliations

  1. XLIM Research Institute, 123 av. A. Thomas, 87060, Limoges, France

    Mohamad El Khatib, Arnaud Pothier, Aurelian Crunteanu & Pierre Blondy

Authors
  1. Mohamad El Khatib
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  2. Arnaud Pothier
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  3. Aurelian Crunteanu
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  4. Pierre Blondy
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Correspondence to Mohamad El Khatib.

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El Khatib, M., Pothier, A., Crunteanu, A. et al. A novel packaging approach for RF MEMS switching functions on alumina substrate. Microsyst Technol 13, 1457–1461 (2007). https://doi.org/10.1007/s00542-006-0375-9

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  • DOI: https://doi.org/10.1007/s00542-006-0375-9

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