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Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package

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Abstract

The interfacial reactions and shear properties of the In-48Sn (wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafter OSP). During bonding, continuous AuIn2, Ni3(Sn,In)4, and Cu6(Sn,In)5 intermetallic compound (IMC) layers were formed at the solder/E-NG, solder/ENIG and solder/OSP interfaces, respectively. The interfacial reactions between the solder and I-Ag substrate during bonding resulted in the formation of Cu6(Sn,In)5 and Cu(Sn,In)2 IMCs with a minor Ag. The In-48Sn/I-Ag solder joint showed the best shear properties among the four solder joints after bonding, whereas the solder/ENIG solder joint exhibited the weakest mechanical integrity.

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Acknowledgments

This work was supported by grant No. RTI04-03-04 from the Regional Technology Innovation Program of the Ministry of Commerce, Industry and Energy (MOCIE).

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Authors and Affiliations

  1. School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, 440-746, Republic of Korea

    Ja-Myeong Koo & Seung-Boo Jung

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  1. Ja-Myeong Koo
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  2. Seung-Boo Jung
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Correspondence to Seung-Boo Jung.

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Koo, JM., Jung, SB. Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package. Microsyst Technol 13, 1567–1573 (2007). https://doi.org/10.1007/s00542-006-0344-3

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  • DOI: https://doi.org/10.1007/s00542-006-0344-3

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