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Thermo-mechanical analysis of advanced electronic packages in early system design

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Abstract

The thermal and thermo-mechanical behaviour of advanced electronic packages should be taken into account from the initial design phase in order to achieve a high level of reliability. Numerical studies by means of finite element (FE) analyses are very useful in order to reveal and evaluate the essential thermal and mechanical influences which are induced during manufacturing, storing, transport, and operation. Two different types of packages are under investigation, an RF-system on chip including digital and analogue parts on one chip (RF SoC), and combined in a BGA-type package, made by Shellcase Ltd, and a power transistor with all contacts on one side. Parametric FE analyses are presented in order to pre-optimise the shape of the interconnects and to improve the compliance between stiff components before prototyping and real testing.

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References

  • Brotzen FR (1994) Mechanical testing of thin films. Int Mat Rev 39(1):24–45

    Google Scholar 

  • Sommer J-P (2002) Thermo-mechanical reliability for high frequency applications. Ser Micromater Nanomater 50–53

  • Sommer J-P (2004) Support of the design process for advanced electronic components by means of finite element analysis. Ser Micromater Nanomater 268–273

  • Sommer J-P, Michel B, Goebel U, Jelonnek J (2000a) Thermally optimised millimeter wave package on a LTCC ceramic board. In: Proc. ITherm 2000, Las Vegas, May 23–26, 2000, pp 355–360

  • Sommer J-P, Michel B, Döring R, Hager W, Rehme F (200b) Thermo-mechanical design support by means of FEA for advanced millimeter wave communication devices. In: Micro materials, Berlin, April 17–19

  • Sommer J-P, Wittler O, Manessis D, Michel B (2003) Design process supporting simulations on wafer level packages. In: Proc. conf. design, test, integration and packaging of MEMS/MOEMS (DTIP 2003), Mandelieu (F), May 5–7, 2003, pp 45–49

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Acknowledgements

The authors would like to thank the European Commission for financial support of this work in the framework of the BLUEWHALE (IST-2000-30006) Project. Also, the fruitful co-operation with Philips, ShellCase, DIMES, and DEK through the Blue Whale project is greatly appreciated.

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Authors and Affiliations

  1. Department of Mechanical Reliability and Micro Materials, Fraunhofer Institute for Reliability and Micro Integration (IZM), Berlin, Germany

    Johann-Peter Sommer & Bernd Michel

  2. Technical University of Berlin, Micro-Peripheric Technology Center, Gustav-Meyer-Allee 25, 13355, Berlin, Germany

    Olaf Wittler & Dionysios Manessis

Authors
  1. Johann-Peter Sommer
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  2. Olaf Wittler
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  3. Dionysios Manessis
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  4. Bernd Michel
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Correspondence to Johann-Peter Sommer.

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Sommer, JP., Wittler, O., Manessis, D. et al. Thermo-mechanical analysis of advanced electronic packages in early system design. Microsyst Technol 12, 75–81 (2005). https://doi.org/10.1007/s00542-005-0024-8

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  • DOI: https://doi.org/10.1007/s00542-005-0024-8

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