Micro-ECM for production of microsystems with a high aspect ratio

Abstract

The most used processes for production of microsytem components are basically from the semiconductor technology. The material properties of used silicon often don’t achieve the demands of for example: micro-surgery, biotechnology life science, fluidics or high temperature environment. For microstructuring of highly stressed metals, like stainless and heat resisting steels, cold work tool steels, hot work tool steels and nickel-base-alloys and a variety of metals there is no manufacturing-process. An interesting possibility for structuring this type of materials are the electrochemical machining processes (ECM). Some new developed ECM-sinking-processes are working with oscillating tool-electrode, to improve shape accuracy.