Abstract
In this paper, we proposed a new approach of three-dimensional (3-D) micromachining without using any masks. This approach is a direct writing using synchrotron radiation (SR) etching. Several approaches to fabricate 3-D microstructures using photo-lithography have been proposed. However, these approaches are limited to fabricate microstructures due to the using mask process. SR etching is a dry process, and the etching rate of PTFE (polytetrafluoroethylene) is so high (100 μm/min) in vacuum using the SR white light. By utilizing a high processing speed and smoothness of the etched surfaces, SR etching might have a potential for 3-D micromachining by combining the direct writing with a stage having a high degree of freedom. Here, we reported the results of 3-D micromachining of PTFE using SR etching in vacuum and examined the dependence of SR etching of PTFE on the etching environment under an atmospheric pressure of He.
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Received: 10 August 2001/Accepted: 24 September 2001
This paper was presented at the Fourth International Workshop on High Aspect Ratio Microstructure Technology HARMST 2001 in June 2001.
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Nishi, N., Katoh, T., Ueno, H. et al. Study on three-dimensional micromachining using synchrotron radiation etching. Microsystem Technologies 9, 1–4 (2002). https://doi.org/10.1007/s00542-001-0169-z
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DOI: https://doi.org/10.1007/s00542-001-0169-z