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The effect of silicon substrate on thickness of SiO2 thin film analysed by spectral reflectometry and interferometry

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Abstract

Techniques of spectral reflectometry and interferometry are used for measuring small changes in thickness of SiO2 thin film grown by thermal oxidation on different silicon substrates. A slightly dispersive Michelson interferometer with one of its mirrors replaced by a thin-film structure is used to measure the reflectance and interferometric phase of the thin-film structure at the same time. The experimental data are used to determine precisely the thickness of the SiO2 thin film on silicon wafers of two crystallographic orientations and different dopant concentrations. We confirmed very good agreement between the experimental data and theory and revealed that the thin-film thickness, which varies with the type of silicon substrate, depends linearly on the wavelength at which minimum in the spectral reflectance occurs. Similar behaviour was revealed for the interferometric phase.

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Authors and Affiliations

  1. Department of Physics, Technical University Ostrava, 17, listopadu 15, 708 33, Ostrava-Poruba, Czech Republic

    P. Hlubina, J. Luňáček & D. Ciprian

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  1. P. Hlubina
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  2. J. Luňáček
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  3. D. Ciprian
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Correspondence to P. Hlubina.

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Hlubina, P., Luňáček, J. & Ciprian, D. The effect of silicon substrate on thickness of SiO2 thin film analysed by spectral reflectometry and interferometry. Appl. Phys. B 95, 795–799 (2009). https://doi.org/10.1007/s00340-009-3418-y

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  • DOI: https://doi.org/10.1007/s00340-009-3418-y

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